Thermalloy, Inc.

Other

Matthew C Smithers

Howard G Hinshaw

Donald L Clemens

William D Jordan

Donald L Bland

Michael M Heatly

Mark C Mellinger

Jay Rasmussen

A reversible modular beverage can interlocking device which is adapted for forming a plurality of conventional beverage cans into a building block for use as a toy or in display applications or in building construction. The device generally comprises a plurality of thermoplastic reversible annular means for can retention, each sized and shaped for the releasable retention of either the top lipped portion of a beverage can, or the bottom non-lipped portion of a beverage can.

Reversible modular can interlocking device

A modular beverage can interlocking device that is adapted for forming a plurality of conventional beverage cans into a building block for use as a toy or in display applications. The device generally comprises a plurality of ring-shaped members, each having an upper orifice which is configured with an upper lip retention portion for releasably retaining the top portion of a conventional beverage can via a snap-fit. Conversely, the lower orifice of each of the ring-shaped members is optimally contoured to hold the lower portion of the conventional beverage can via at a snug friction-fit. The top portion of a plurality of beverage cans may be releasably retained in the upper lip retention portion via insertion through the lower orifice, thereby defining a distribution orientation that is optimally suited for distribution of beverage product in the normal manner. Conversely, the top portion of a plurality of beverage cans may be releasably retained in the retention portion via insertion through the upper orifice, whereby the device and cans define a building block for placement one upon another.

Modular beverage can interlocking device

A modular beverage can interlocking device which is adapted for forming a plurality of conventional beverage cans into a building block for use as a toy or in display applications. The device generally comprises a plurality of ring-shaped members, each having an upper and lower orifice which is optimally contoured to hold the lower and upper end of a conventional beverage can respectively via at least a snug friction-fit. Preferably, the lower orifice has an inwardly facing annular slot for releasable retention of the upper lip of a conventional can via a snap-fit, and most preferably, has multiple inwardly facing annular slots of varying diameter in order to provide a snap-fit for cans of varying outer dimensions. Optional designs are provided which enable the use of thermoplastic materials having a wide range of hardnesses as well as end-cap means which provide for rigid securement to any generally flat surface.

A strap spring for insertion into a circuit board for securing a heat sink to an electronic device is disclosed that has a body portion having two ends and a contact section and one or more engaging sections extending from said ends. The ends are inserted into an aperture in the circuit board and an aperture in the heat sink to anchor the circuit board to the heat sink. Electronic assemblies comprising a circuit board having a microprocessor and a heat sink having a surface larger than the microprocessor are also disclosed in which a strap spring is disposed on a side of the circuit board opposite the heat sink, and the strap extends through the circuit board to engage the heat sink.

Strap spring for attaching heat sinks to circuit boards

Heat sinks and electrical components pre-coated with a layer of a material such as thermal grease are disclosed. Contamination and migration of the thermal grease is substantially reduced by covering the coated areas with a release liner that is removed prior to the assembly of the heat sink into a circuit board or other assembly. By providing a pre-coated heat sink, productivity can be enhanced by increasing accuracy with which the thermal grease is applied, thus eliminating waste and clean up. Methods for pre-coating either a heat sink or the release liner with thermal grease are also disclosed. In preferred embodiments areas of the heat sink can be either fully coated, or portions electively coated, and the coating is most preferably accomplished by pushing grease through an applicator head that has numerous small nozzles. A system and method for dispensing grease either onto a heat sink, onto an electrical component capable of mounting to the heat sink, or onto a release liner that is later applied to the heat sink or electrical component is also disclosed. The release liner is preferably provided with a pull-off tab to facilitate the removal of the release liner. The present invention also discloses improved methods of installing a heat sink using heat sinks that are pre-coated with thermal grease.

Applicator head

A strap spring mounts a heat sink to an electronic device by snapping holes in the leg over ears of a catch on the socket. Two perpendicularly extending springs have an opening between them so that the springs fit between the fins of a heat sink and are latched in ratched indentations.

Strap spring for heat sink clip assembly

A heat dissipation system for a heat generating electronic device includes a releasable attachment assembly for removably securing a heat sink to a heat spreader plate thereof includes at least one spring clip for biasing the heat spreader plate into a secured engagement with the heat sink. The spring clips are adapted to allow easy engagement and/or disengagement of the heat sink from the heat spreader plate, thereby facilitating the use of variously configured heat sinks as part of the heat dissipation system.

Heat dissipation system having releasable attachment assembly

Heat sinks and electrical components pre-coated with a layer of a material such as thermal grease are disclosed. Contamination and migration of the thermal grease is substantially reduced by covering the coated areas with a release liner that is removed prior to the assembly of the heat sink into a circuit board or other assembly. By providing a pre-coated heat sink, productivity can be enhanced, by increasing accuracy with which the thermal grease is applied, thus eliminating waste and clean up. Methods for pre-coating either a heat sink or the release liner with thermal grease are also disclosed. In preferred embodiments areas of the heat sink can be either fully coated, or portions electively coated, and the coating may be accomplished by a silk screening or pad printing process, which includes using an applicator head. The release liner is preferably provided with a pull-off tab to facilitate the removal of the release liner. The present invention also discloses methods and devices for packaging a heat sink and an electrical component capable of mounting to the heat sink that has a layer of thermal grease disposed on its surface. The present invention also discloses improved methods of installing a heat sink using heat sinks that are pre-coated with thermal grease.

Heat sink packaging devices

Heat sinks pre-coated with a layer of a material such as thermal grease are disclosed. Contamination and migration of the thermal grease is substantially reduced by covering the coated areas with a protective film that is removed prior to the assembly of the heat sink into a circuit board or other assembly. By providing a pre-coated heat sink, productivity can be enhanced, by increasing accuracy with which the thermal grease is applied, thus eliminating waste and clean up. Methods for pre-coating either a heat sink or the protective film with thermal grease are also disclosed. In preferred embodiments areas of the heat sink can be either fully coated,, or portions electively coated, and the coating is most preferably accomplished by a silk screening or pad printing process. The protective film is preferably provided with a tear off tab to facilitate the removal of the protective film. The present invention also discloses improved methods of installing a heat sink using heat sinks that are pre-coated with thermal grease.

Pre-application of grease to heat sinks with a protective coating

A clip secures a heat sink having a slot with grooves on opposing sides thereof to a transistor. The frame has sides with a width therebetween which can be wedged into grooves on opposing sides of a slot in the heat sink. A portion of the frame is raised up between two parallel cuts in the frame. A transistor is wedged under the raised up portion. The clip has legs which are insertable into a printed circuit board for easy assembly of a heat sink, transistor, clip and printed circuit board.

Solderable transistor clip and heat sink

An anchor for mounting a heat sink and an electronic device on a printed circuit board has a plastic body. An arcuate groove or protruberance is engaged by a spring. The anchor has a neck which is inserted into a hole in a printed circuit board. A pin in a hole in the body is pushed into the neck to spread it to secure the anchor to the printed circuit board. The assembly is formed by attaching a wire or clip spring to the anchor.

Growing community of inventors

Lewisville, TX, United States of America

Matthew C Smithers