Kulicke and Soffa Industries, Inc.

Matthew B Wasserman

Thomas J Colosimo, Jr

Michael P Schmidt-Lange

Horst Clauberg

Daniel P Buergi

Ai Jun Song

Adeel Ahmad Bajwa

Thomas Colosimo

Jeremy Neyhart

Benjamin D Trabin

Christopher W Braun

Matthew E Tarabulski

Horst Claubeg

A method of monitoring gas byproducts of a bonding system is provided. The method includes: providing a plurality of bonding systems, each of the bonding systems including a reducing gas delivery system for use in connection with a bonding operation, each of the bonding systems being configured for exhausting gas byproducts; connecting each of the bonding systems to a monitoring device using a respective gas delivery path; and monitoring a composition of at least a portion of the gas byproducts with the monitoring device.

Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systems

A bonding system is provided. The bonding system includes (a) a bond head assembly configured for carrying a bonding tool for bonding a semiconductor element to a substrate and (b) a reducing gas conduit for carrying a reducing gas from (i) a reducing gas source to (ii) a bonding area of a bonding system. The reducing gas is configured for use during bonding of the semiconductor element to the substrate at the bonding area. The reducing gas conduit includes a catalyst for producing excess reducing species in the reducing gas prior to the reducing gas reaching the bonding area.

Bonding systems, and methods of providing a reducing gas on a bonding system

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The bonding tool also includes a standoff extending from the body portion, and configured to contact the substrate during at least a portion of the bonding process.

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

A bond head assembly for a bonding machine is provided. The bond head assembly includes a body portion and a bonding tool for bonding a semiconductor element to a substrate. The bonding tool is secured to the body portion. The bond head assembly also includes at least one reflective optical element carried by the bond head assembly. The at least one reflective optical element is configured to be positioned along an optical path of the bonding machine such that a vision system of the bonding machine is configured to view a portion of the semiconductor element while being carried by the bonding tool prior to bonding of the semiconductor element to the substrate.

Bond head assemblies including reflective optical elements, related bonding machines, and related methods

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.

Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.

Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines

A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.

Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same

A thermocompression bonding system for bonding semiconductor elements is provided. The thermocompression bonding system includes (1) a bond head assembly including a heater for heating an semiconductor element to be bonded, the bond head assembly including a fluid path configured to receive a cooling fluid; (2) a pressurized cooling fluid source; (3) a booster pump for receiving a pressurized cooling fluid from the pressurized cooling fluid source, and for increasing a pressure of the received pressurized cooling fluid; (4) a pressurized fluid reservoir for receiving pressurized cooling fluid from the booster pump; and (5) a control valve for controlling a supply of pressurized cooling fluid from the pressurized fluid reservoir to the fluid path.

Thermocompression bonding systems and methods of operating the same

A method of operating a thermocompression bonding system is provided. The method includes the steps of: (a) applying a first level of bond force to a semiconductor element while first conductive structures of the semiconductor element are in contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; (b) measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures; (c) determining a corrective motion to be applied based on the lateral force measured in step (b); and (d) applying the corrective motion determined in step (c).

Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding

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Philadelphia, PA, United States of America

Matthew B Wasserman