Entegris, Inc.

Matthew B Nicolas

Patrick Doering

Christopher J Vroman

Michael C Zabka

Chester L Bejtlich

Chintan Patel

David Trio

Bradley H Wood

David Molitor

Christopher Vroman

A method of packaging a CMP brush having a cylindrical brush portion and a pair of end connection portions. The method includes saturating the brush with a liquid; covering the cylindrical brush portion with a flexible sheet that extends around and engages the surface of the cylindrical portion; engaging each of the end connection portions with a respective end support; inserting the dampened brush into a rigid polymer tubular shipping container and supporting the end connection portions within the polymer tube; and providing an additional exterior self-supporting packaging.

CMP brush packaging

The invention relates to transport and shipping containers for wafers that are processed into semiconductor units. The wafer transport system provides wafer carriers that provide damage protection and particulate protection with minimal contamination of the wafers in the shipper. The invention includes a wafer cushion for cushioning semiconductor wafers that is made of a closed-cell polyethylene material with a surface resistivity of less than 5&#xd7;10ohms per square that has less than 1800 ng/g Cl, 400 ng/g F/Acetate, 270 ng/g NO, 350 ng/g SO, and 60 ng/g POions leachable under moderate conditions. The wafer cushion optimally has no detectable outgassing organics under stringent conditions. The static control properties are the result of carbon that is part of the structure of the material.

System for cushioning wafer in wafer carrier

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Belle Plaine, MN, United States of America

Matthew B Nicolas