International Business Machines Corporation

Lenovo (Singapore) Pte. Ltd.

Matthew Aaron Heller

Gregg J Armezzani

Jeffrey Scott Holland

Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments are disclosed. According to an aspect, a method includes using a cool sink to transfer thermal energy from an environment. The method also includes using a thermal energy transfer device to transfer the thermal energy to liquid within a conduit. Further, the method includes transporting the liquid containing the transferred thermal energy away from the environment such that the thermal energy within the environment is reduced.

Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments

An electronic package which includes first and second circuitized substrates secured together by a solder member which includes a first contact portion for attachment to a printed circuit board and a second contact portion used to bond the two substrates together (e.g., to form a multi-chip module). Semiconductor chips can be positioned on and electrically coupled to the formed solder members.

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Raleigh, NC, United States of America

Matthew Aaron Heller