Honeywell International Inc.

Matthew A Tehan

Armand R Losinski

David Hursig

Jay Berkley Parkinson

An apparatus is provided for a fuel tank system for an air vehicle. The system comprises a container having an interior adapted to hold fuel, the container comprising a first opening placing the interior in fluid communication with the ambient atmosphere, and a volumetrically-adjustable sizing device adapted to change volume in response to changes in surrounding air pressure, the sizing element disposed within the container and adapted to contain a fluid.

Ambient pressure-responsive variable volume fuel tank

Methods and systems for planning, managing, and executing the flight path of an unmanned aerial vehicle are disclosed. In particular, the methods and systems are designed to reduce the likelihood that the UAV will be detected by determining a flight path based on the proximity of the UAV to a point of interest and the visual, acoustic, and infrared signatures of the UAV relative to a point of interest. Additionally, the methods and systems enable a UAV operator to compare a recommend flight path and an altered flight path based on how the altered flight path changes the proximity of the UAV to a point of interest, and changes the visual, acoustic, and infrared signatures of the UAV relative to a point of interest.

Flight path planning to reduce detection of an unmanned aerial vehicle

An integrated thermal management system for electronic devices includes a printed wiring board for supporting electronic devices, at least one die-up and one die-down electronic device, a frame and a heat sink. The board includes at least one thermally conductive layer, to which the die-down device is thermally connected. The frame member, which includes at least a first heat sink mounting location, is connected to one of the first and second surfaces of the board, adjacent to the edge. The heat sink itself, which is cantilevered over the die-up electronic device from at least one heat sink mounting location, includes a portion which is adapted to engage the die-up electrical device, a portion connected to the frame member to provide a conductive path from the die-up device to the frame member, and a convective cooling portion. The thermal management structure also includes a cold wall, which engages the frame to provide a thermally conductive connection between the frame member and the cold wall. The heat sink(s) covers only the die-up electronic device(s) and those portions of the board surface(s) between the die-up electronic device(s) and the frame necessary to thermally connect the die-up electronic device(s) to the frame, to thereby provide access to the board surfaces for inspection or testing without removal of the heat sink(s).

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Albuquerque, NM, United States of America

Matthew A Tehan