Headway Technologies, Incorporated

Psiquantum Corp.

Celestial Ai Inc.

Matteo Staffaroni

Xuhui Jin

Albert Wang

Ramakanth Alapati

John Eugene Berg

Gabriel J Mendoza

Subal Sahni

Weihao Xu

Saurabh Vats

Ismail Hakki Ozguc

Kevin Park

Tobias Maletzky

Koji Shimazawa

Cherng-Chyi Han

Yoshihiro Tsuchiya

Tsutomu Chou

Faraz Najafi

Kenichi Takano

Vimal Kumar Kamineni

Yong Liang

Jianing Zhou

Shengyuan Wang

Dayu Zhou

Luc Chung

George Kovall

Ann Melnichuk

Weisheng Hu

Ya-An Yang

A system-in-package includes: a photonic integrated circuit (PIC) including an active photonic component; and an electronic integrated circuit (EIC) stacked on the PIC, the EIC including: an electrical component electrically connected to a landing pad, and a copper pillar embedded in the landing pad and protruding from the landing pad that connects with the active photonic component such that the electrical component is electrically connected to the active photonic component. The landing pad has a larger surface area than a cross sectional area of the copper pillar, and wherein, when viewed from the EIC towards the PIC, the active photonic component on the PIC is offset from the landing pad of the EIC, wherein the offset is sufficient to keep a parasitic capacitance between the landing pad and the active photonic component within a pre-determined threshold level of tolerance.

Electrical interconnects for packages containing photonic integrated circuits

A device includes a substrate, a dielectric layer on the substrate, a waveguide within the dielectric layer, and a photodetector optically coupled to the waveguide. The photodetector is disposed above the waveguide layer and is monolithically integrated with the substrate. The photodetector is configured to operate at low temperatures, such as below about 50 K or about 20 K. In some embodiments, the monolithic photonic device includes thermal isolation structures and optical isolation structures. Techniques for manufacturing the monolithic photonic device, including the thermal isolation structures and optical isolation structures, are also described.

Photonic integrated circuit

A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. A coupler is bonded to a first surface of the first die, an optical fiber is coupled to the coupler for coupling light from the optical fiber to the quantum circuit.

Photonic quantum computer assembly with a quantum computing die facing an electronic circuit die

A device includes a die stack including a first die including a quantum circuit and a second die including an electronic circuit. The second die and the first die face each other. The device also includes a first interconnect between the quantum circuit and the electronic circuit and a second interconnect between the quantum circuit and the electronic circuit.

Photonic quantum computer assembly

Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

Quantum computing die assembly with thru-silicon vias

Photonic quantum computer assembly having dies with specific contact configuration and matched CTE

Quantum computing die assembly with thru-silicon vias and connected logic circuit

A TAMR (thermally assisted magnetic recording) write head uses a gap-based NFT (near-field transducer) to create plasmon near field energy. In one embodiment the NFT is a double ridge aperture structure that simultaneously delivers low transition curvature and better cross-track thermal gradients than previous designs. In another embodiment a NFT comprises a top and bottom ridge not confined to an aperture structure, made of thermo-mechanically stable materials and a parabolic shaped metal layer disposed adjacent to a dielectric waveguide core to couple optical energy to surface plasmon modes.

Double ridge near-field transducers

A near field transducer (NFT) is formed between a waveguide and main pole layer at an air bearing surface (ABS). The NFT includes a resonator body layer made of Au, for example, with a front side at a first plane that is recessed a first distance from the ABS and a back side that is at a second plane formed parallel to the ABS and first plane. The NFT also has a peg layer with a rectangular peg portion between the ABS and first plane, and a larger back portion between the first and second planes that overlays directly above the resonator body layer. The peg layer is preferably made of Rh to improve mechanical stability of the NFT without significantly degrading overall optical efficiency of the NFT. A blocker may be formed between the ABS and waveguide to prevent light not coupled to the NFT from reaching the ABS.

Self-aligned hybrid Au&#x2014;Rh near field transducer for enhanced reliability

A TAMR (thermally assisted magnetic recording) write head uses weakly plasmonic materials to create plasmon near field energy. The replacement of highly plasmonic materials like Au with weakly plasmonic materials like Rh avoids the thermal deformations of softer metals like Au. To maintain the performance of the head, it includes pre-focusing structures that concentrate plasmon energy by the creation of surface plasmon polaritons which are converted to more narrowly confined plasmons by excitation by a tapered waveguide. A waveguide blocker at the distal end of the waveguide enhances the formation of surface plasmon polaritons at the interface between the blocker and the distal end of the waveguide. A pair of symmetrically disposed optical side shields are formed to either side of the pole tip and a weakly plasmonic optical field enhancer further strengthens the optical field.

Single Rh layer optical field enhancer with pre-focusing structures

An optically shielded TAMR (thermally assisted magnetic recording) write head has a metal waveguide blocker formed against a distal end of a waveguide and a pair of symmetrically disposed optical side shields formed to either side of a plasmon generator formed above the waveguide. The waveguide focuses optical radiation on the adjacent plasmon generator where it excites plasmon modes that heat the recording medium with near-field energy and the waveguide blocker prevents excess optical radiation from blurring the spot on the recording region. The optical side shields further restrict loosely coupled optical radiation from reaching the recording region and blurring the optical spot and improves down-track and cross-track thermal gradients.

Thermally-assisted magnetic recording head having symmetric optical side shields

A thermally assisted magnetic recording head is disclosed with a light delivery waveguide circuit wherein a middle section of the primary waveguide (WG) has a curved portion. In one embodiment, the curved portion connects to a front WG section at the air bearing surface (ABS) and is offset in a cross-track direction from the laser diode to prevent stray light from heating metal parts proximate to the front section and undesirable writer protrusion. Optionally, a reflective blocker is inserted between the WG spot size converter and ABS. In a second embodiment, the laser diode, spot size converter, and front WG section are all aligned along a center slider plane. The curved portion has at least one 180&#xb0; bend to bend light around the blocker that is between the spot size converter and WG front section. The blocker is tilted to prevent reflected light from returning to the laser diode.

Thermal assisted magnetic recording light delivery waveguide circuit for reduced stray light induced writer protrusion

Growing community of inventors

San Ramon, CA, United States of America

Matteo Staffaroni