International Business Machines Corporation

International Business Corporation

Matteo Flotta

Lubomyr Taras Romankiw

John Michael Cotte

John Ulrich Knickerbocker

Theodore Gerard Van Kessel

Bucknell Chapman Webb

Gareth Geoffrey Hougham

Yves Corfield Martin

Wayne Martin Moreau

Jon Alfred Casey

Stephen L Buchwalter

Sung Kwon Kang

Claudius Feger

Panayotis Constantinou Andricacos

Kenneth John McCullough

Charles Jesse Taft

John Patrick Simons

Xiaoyan Shao

Steven Erik Steen

Leena Paivikki Buchwalter

John Owen Dukovic

Anurag Jain

Kathleen Conlon Hinge

Veeraraghavan S Basker

Hariklia Deligianni

Jeffrey Donald Gelorme

Keith Randal Pope

Kwong-Hon Wong

Robert W Hitzfeld

Kirk G Berridge

Frank A Spera

Robert M Browne

Moritz Branger

Otto P Schick

Jeffrey S Richter

Helmut R Poweleit

Jose Ordonez

Donald R McKenna

Benjamin W Fu

Lubomyr T Romanikiw

Saeed Sahami

Jeffrey D Gelmore

In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.

Method and apparatus for chip cooling

An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.

Apparatus and method for electrochemical processing of thin films on resistive substrates

An apparatus for plating a magnetic film on a substrate includes: a track including a plurality of stopping points along the track; a permanent magnet placed on the track such that the permanent magnet can be moved along the track towards and away from the stopping points; at least one plating tank positioned on the stopping point; and a removable high permeability iron flux concentrator inserted into gaps between the substrate and inside walls of the plating tank, substantially surrounding the substrate and extending around and under the substrate.

Apparatus for an enhanced magnetic plating method

Enhanced magnetic plating method

The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

A workpiece holder for processing a workpiece in a chamber of a liquified fluid. In one embodiment, the workpiece holder includes a cylindrically shaped rotator having an exterior wall and at least one fluid guide on the exterior wall. The rotator is adapted to rotate and provide fluid flow across a first end of the rotator, and is adapted to provide fluid flow and mixing perpendicular to a surface of the first end of the rotator. A fixture is coupled to the first end of the rotator for securing the workpiece to the first end of the rotator.

Turbine part mount for supercritical fluid processor

Fixtures and methods for clamping workpieces in a workplace to enable the optimized exposure thereof to a stream or flow of a supercritical fluid. Provided is a rotatably indexable chuck or locator mounting the workpiece and enabling orientating the latter in specific static pitch position within a high pressure vessel in order to subject the workpiece to a full frontal exposure to the supercritical fluid stream within the vessel. This mounting arrangement facilitates an optimum positioning of the workpiece being processed in the flow path of the supercritical fluid stream while oriented in selectively indexed rotational positions.

Fixtures for processing a workpiece in a supercritical fluid

An electroplating cell includes a floor, ceiling, front wall, and back wall forming a box having first and second opposite open ends. A rack for supporting an article to be electroplated is removably positioned vertically to close the first open end and includes a thief laterally surrounding the article to define a cathode. An anode is positioned vertically to close the second open end, with the assembly defining a substantially closed, six-sided inner chamber for receiving an electrolyte therein for electroplating the article. The article and surrounding thief are coextensively aligned with the anode, with the floor, ceiling, front and back walls being effective for guiding electrical current flux between the cathode and the anode. In a preferred embodiment, the cell is disposed as an inner cell inside an outer cell substantially filled with the electrolyte, and a paddle is disposed inside the inner cell for agitating the electrolyte therein. The rack is removable and installable vertically upwardly which allows for automated handling thereof.

Vertical paddle plating cell

A multi-compartment electroplating system for electroplating two or more objects simultaneously such that the electrodeposited material is substantially uniform in thickness and composition. Electroplating solution is circulated between a reservoir and a multi-compartment tank which has one cathode-paddle-anode (CPA) assembly for each compartment. Each CPA assembly has an anode, a cathode adapted for holding a wafer and employing a single thieving electrode which covers all of the floor of the compartment not covered by the wafer, and a paddle. Also included is a cover which houses a single linear motor for driving all of the paddles in synchrony.

Multi-compartment eletroplating system

Growing community of inventors

Fishkill, NY, United States of America

Matteo Flotta