Advantest America, Inc.

Matt Losey

Melvin Khoo

Florent Cros

Yohannes Desta

Chang Huang

Laksmi Namburi

Provided are microfabricated probe elements, including elastomer elements, and methods of making the same, that can be readily used with fine pitch microelectronic arrays, for instance by providing sufficient compliance in a small package, while minimizing deflection forces, and while precisely maintaining the planarity and positioning of the contact tips across vast grid arrays. Elastomer elements may be generated using photolithography, either directly or through a sacrificial lost-mold process. Elastomer probe elements are provided with rigid tip structures microfabricated thereon to improve contact pressure. A novel space transformation probe card assembly is also provided.

Fine pitch microelectronic contact array and method of making same

A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. The adjustment mechanisms allow for quick, sensitive adjustment of the positions of microelectronic contactors relative to semiconductor devices to be tested.

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Baldwin Park, CA, United States of America

Matt Losey