Honeywell International Inc.

Matt Loesch

Mark Eskridge

Galen P Magendanz

Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.

Growing community of inventors

Snohomish, WA, United States of America

Matt Loesch