Telefonaktiebolaget Lm Ericsson (publ)

Mats Gunnar Olsson

Mats Ove Larsson

Paul Larsson

Erik M&ouml;ster

Rafael Portela

Olof Simonsson

Zhinong Ying

Sven Gunnar Wretemark

Carl Ove Tollerz

An antenna device () for a portable telecommunication apparatus () has a first antenna () adapted for telecommunication in at least a first frequency band and a second antenna () adapted for short-range supplementary communication in a second frequency band. The first and second antennas () are formed on a common support element ().

Antenna device, and a portable telecommunication apparatus including such an antenna device

A liquid crystal display panel in a mobile telephone is directly mounted to either a printed circuit board or a frame portion of a mobile telecommunication instrument, e.g., a telephone. An angular mounting structure for the liquid crystal display panel has a pair of support ribs that extend outwardly from a substantially planar portion of a frame, or back cover, of a telephone. Thus, the need for additional mounting parts is obviated. In one embodiment, the liquid crystal display panel is biasedly received within recesses provided on distal ends of support ribs extending from the frame portion. Preferably, the distal ends of the ribs have distal end surfaces which are adapted to fixedly support the liquid crystal display panel in predefined nonparallel relationship with respect to the planar portion of the back cover, with the aid of an adhesive material, e.g., a two sided adhesive tape. A method of assembly for mounting the liquid crystal display using the two sided adhesive tape is disclosed.

Method for assembling a liquid crystal display panel in a mobile telephone

A loudspeaker assembly for use in electronic devices especially hand held communication devices e.g. a cellular mobile telephone, comprising a loudspeaker ( ) for emitting sound through a front cover ( ), and a board ( ) for mounting components, the board ( ) having a first side ( ) carrying user interface means ( ) accessible through the front plate ( ), and a second side ( ), facing towards a back cover ( ). The loudspeaker ( ) is mounted between the board ( ) and the back cover ( ). Thereby the electronic devices can be made very compact.

Loudspeaker assembly

A housing for a device like a mobile phone has a front cover and a back cover mechanically connected to the front cover. A cover connector member is connected along the seam between the front and back covers to reduce the effects of mismatches in cosmetic appearances and in mechanical connections between the front and back covers. A method of assembling the device includes mechanically connecting the front and back covers to form a housing and mechanically connecting a cover connector member to the housing.

Method and apparatus for reducing effect of mismatches and increasing the rigidity of mobile communication device

A multiconnector for a handheld telephone includes connectors for a SIM card, an internal battery, and a microphone, as well as additional connectors for other external devices. The multiconnector is mounted to a printed circuit board (PCB) in the telephone and makes electrical contact between the connectors and the PCB. Incorporation of all of the connectors into a single, integral multiconnector simplifies manufacturing and reduces the number of components necessary to construct the telephone.

Multiconnector for mobile telephones

A housing for electronic components is injection molded as a unitary, single-piece, monolithic piece, and includes a front cover, a back cover, and a living hinge. Electronic components, including a PCB, are contained within the housing. A cosmetic cover is secured to the housing over the living hinge, which protrudes from the housing, to make the housing more appealing.

Encapsulation of printed circuit boards

A cable for carrying high voltage has encompassed on its metallic conductor core with an inner layer of semiconducting material. An insulation layer encompasses this semiconducting layer and is in turn encompassed by an outer semiconducting layer. This outer semiconducting layer is strongly bonded to the underlying insulation layer and its outer surface resistivity is selected to be within the range of 10.sup.7 - 10.sup.9 ohm/square. Such resistivity range equalizes the voltage distribution within the cable jacket and also facilitates splicing cable ends and terminating the cable as the outer semiconducting layer need not and in fact cannot be readily removed.

Growing community of inventors

Stockholm, Sweden

Mats Gunnar Olsson