Abb Schweiz Ag

Abb Research Ltd.

Abb Technology Oy

Abb Technology Ag

Mathieu Habert

Bruno Agostini

Francesco Agostini

Daniele Torresin

Thomas Gradinger

Timo Koivuluoma

Munaf Rahimo

Uwe Drofenik

Anders Blomberg

Jing Ni

Jürgen Hafner

Cajetan Pinto

Antonello Antoniazzi

Didier Cottet

Oscar Apeldoorn

Daniel Kearney

Matti Kauranen

Gernot Riedel

Roman Jauhonen

Jouko Siirilä

Christian Meckel

Heikki Elomaa

Jari Sundelin

Francesco Moraschinelli

Anna Rumpunen

Markku Elo

Thomas Paul

A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element. Each pipe of the plurality of pipes may include a group of channels. Each of the first and second fluid distribution elements may include a plate of a first type. Each plate of the first type may include openings for providing alignment functionality for the plurality of pipes. The first fluid distribution element may include a plate of a second type that may include openings for providing fluid paths between the pipes. The plate of the second type may be positioned on a side of the plate of the first type of plates of the first fluid distribution element that is opposite to the second fluid distribution element.

Heat exchange device based on a pulsating heat pipe

A heat exchanger assembly is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit, the passive cooling circuit including an evaporator connectable to a device to be cooled for conducting heat from the device to be cooled to the cooling fluid within the evaporator, thereby evaporating the cooling fluid, and a condenser interconnected with the evaporator for receiving the evaporated cooling fluid from the evaporator, releasing heat from the cooling fluid to an environment of the condenser, thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit comprising a compressor and an auxiliary condenser, the active partial circuit being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit, the cooling fluid from the evaporator, for compressing the received cooling fluid by the compressor, for releasing heat, by the auxiliary condenser, from the compressed cooling fluid to an environment of the auxiliary condenser, and for returning the condensed cooling fluid to the evaporator. Furthermore, the passive cooling circuit is a base-to-air type thermosiphon or an air-to-air type thermosiphon.

Heat exchanger assembly and method for operating a heat exchanger assembly

This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.

Cooling apparatus and method

A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100&#xb0; C.

Cooling of wide bandgap semiconductor devices

A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.

Cooling assembly and method for manufacturing the same

A cooling device for cooling at least two power electronic devices by a working fluid. The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement with a heat dissipator portion of the Pulsating Heat Pipe circuit system and a plurality of fins thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.

Cooling device and method for cooling at least two power electronic devices

The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.

Heat exchanger

The invention relates to a cooling element () comprising: a fluid channel () providing a pulsating heat pipe, a first evaporator () for receiving heat from electric components () and for passing the heat into fluid in the fluid channel (), and a first condenser () for receiving fluid from the first evaporator () via the fluid channel () and for cooling fluid in the fluid channel. In order to obtain an even temperature distribution at the first evaporator () an adiabatic zone where the temperature of the fluid in the fluid channel () remains unchanged or a cooling zone, with a second condenser () cooling fluid in the fluid channel (), separates the first evaporator () from the loops () in the second end () of the fluid channel.

Cooling element

It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.

Heat exchanger for power-electronic components

The invention relates to an apparatus () comprising a generator (), an evaporator (), an absorber () and a condenser () circulating a refrigerant (R), an inert (I) and an absorbent (A) in a diffusion-absorption cycle. The generator () and the evaporator () are arranged in an electric cabinet () to receive a heat load from primary electric components () and secondary electric components (). The absorber () and the condenser () are arranged outside of the electric cabinet () and at a higher level than the evaporator () to receive fluid from the generator () and the evaporator () and for dissipating heat from the received fluid to the surrounding environment. The inert (I) and refrigerant (R) are selected such that the inert (I) is heavier than the refrigerant (R) in order to obtain fluid circulation where the inert (I) exiting the absorber () flows downwards to the evaporator () and the inert (I) exiting the evaporator () flows upwards to the absorber ().

Apparatus with diffusion-absorption cycle

An exemplary evaporating unit for cooling a heat emitting device includes a cooling circuit having a stack of evaporating units arranged alternately with heat emitting devices. Each evaporating unit is connected to a condenser and includes a first inlet channel, a first plurality of evaporation channels, and a first outlet channel. The evaporating unit is designed for pre-heating the cooling fluid flowing therein.

Power electronics cooling

The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Power semiconductor module and method for cooling power semiconductor module

An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and a clamping arrangement. Each cooling module includes an evaporator unit, a condenser, a first pipe system, and a second pipe system. The clamping arrangement is adapted for holding and pressing an alternation stack in which the evaporator units are stacked in alternation with the power electronic components.

Modular cooling system

A cooling assembly is disclosed having a device chamber, a cooling chamber, a heat exchanger, a fan and a controller, the heat exchanger having a first heat exchanger unit and a second heat exchanger unit located above the first heat exchanger unit. The fan includes a first fan adapted to generate a first cooling air flow. The cooling assembly further includes a first dust tray located between the first heat exchanger unit and the second heat exchanger unit, the first cooling air flow being directed towards the first dust tray. The first dust tray is adapted to receive and retain at least part of contaminant particles present in the first cooling air flow, the device chamber being separated from the cooling chamber.

Cooling assembly

An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow.

Growing community of inventors

Rheinfelden, Switzerland

Mathieu Habert