Other

Melexis Technologies Nv

Insolight Sa

Melexis Technologies Sa

Mathieu Ackermann

Laurent Coulot

Florian Gerlich

Robert Racz

Jian Chen

Noé Bory

Bruno Boury

Gaël Nardin

David Ziegler

David Schuppisser

The present invention relates to an optomechanical system (), for dynamically controlling the photometric distribution of a luminaire, comprising a static frame (), a light emitting substrate () with one or more light emitting elements () capable of emitting incident light (), an optical layer () comprising one or more optical elements () capable of capturing incident light () and transmitting transmitted light (), and a shifting mechanism () for translationally moving along at least one direction a movable element, which is chosen from either the optical layer () or the light emitting substrate (). The shifting mechanism () comprises further one or more guiding elements (), capable of maintaining the inclination angle between the light emitting substrate () and the optical layer () while moving the movable element (). The optomechanical system is configured in such a way that the photometric distribution of the luminaire is dynamically controllable by adjusting the relative positon of the light emitting elements () with respect to the optical elements (). The present invention relates also to luminaires comprising such an optomechanical system () and to a related method for adjusting the photometric distribution of luminaires.

Optomechanical system and method for controlling the photometric distribution of luminaires and corresponding luminaires

An optomechanical system for absorbing light or emitting light, comprising as static frame element, an optical arrangement, a light absorbing/emitting substrate and a shifting mechanism. The shifting mechanism moves at least one layer of the optical arrangement relative to the light absorbing/emitting substrate or vice versa, wherein the movement is through one or more translation element relative to the static frame element in such a way that the transmitted light can be optimally absorbed by the light absorbing/emitting substrate, or that the incident light emitted by the light absorbing/emitting substrate can be optimally transmitted by the optical arrangement. Furthermore, the present invention also relates to a corresponding method for absorbing light or emitting light with the aforementioned optomechanical system.

Optomechanical system for absorbing light or emitting light and corresponding method

Disclosed is an optomechanical system () for capturing and transmitting incident light () with a variable direction of incidence to at least one collecting element (A,B), with

Optomechanical system for capturing and transmitting incident light with a variable direction of incidence to at least one collecting element and corresponding method

Planar optical module (') for capturing, converging and collimating incident light (&#x2032;) with a variable incident direction comprising: &#x2014;a first optical arrangement () with an optical layer able to converge the incident light-beam (&#x2032;), forming thereby a converging light-beam (&#x2032;) and &#x2014;a second optical arrangement () placed downstream said first optical arrangement (), said second optical arrangement () having an optical layer collimating said converging light-beam(s) (&#x2032;), forming thereby a collimated and concentrated beam (&#x2032;), wherein the first and second optical arrangements () are movable one relative to the other such that the relative position of first and second optical arrangements () allows said collimated and concentrated beam (&#x2032;) to have an orientation which is, in a plane perpendicular to the main plane (P) of the planar optical module (&#x2032;), predetermined, fixed and independent from the direction of the incident light (&#x2032;). Preferentially, the first optical arrangement () comprises two optical layers () movable one relative to the other, the second optical arrangement () comprises either an optical layer formed by one or a plurality of reflective elements () having a concave surface or comprises only one optical layer with variable refractive-index elements () or with fluorescent dyes ().

Planar optical module for tracking and collimating incident light

A method of making a current sensor is described. The method includes providing a leadframe having a current conductor portion comprising two sections shaped such that a current to be measured flows in directions oriented obliquely or oppositely with respect to each other. Further, the method includes deforming the leadframe to lower the current conductor portion, and mounting an isolator on the current conductor portion. The method also includes mounting a semiconductor chip having a thickness of at least 0.2 mm and comprising two magnetic field sensors composed of four Hall sensors and magnetic field concentrators on the isolator, connecting the semiconductor chip and sensor terminal leads by wire bonds, packaging the semiconductor chip and parts of the leadframe in a plastic housing, and cutting a frame of the leadframe from current terminal leads and the sensor terminal leads.

Method of making a current sensor and current sensor

A device for current measurement comprises a substrate with a first current conductor and a current sensor with a second current conductor. The current sensor is mounted above the first current conductor on the substrate. The second current conductor is formed with integrally attached first and second terminal leads through which the current to be measured is supplied and discharged. The current sensor further comprises a semiconductor chip with a magnetic field sensor mounted on the second current conductor on the side of the second current conductor facing the substrate. The magnetic field sensor is sensitive to a component of the magnetic field extending parallel to the surface of the semiconductor chip and perpendicular to the second current conductor. The second current conductor extends above and parallel to the first current conductor.

Device for current measurement

A current sensor comprises a housing of plastic, a current conductor with integrally shaped first and second electrical terminals, through which a current to be measured is supplied and discharged, third electrical terminals, and a semiconductor chip having at least one magnetic field sensor, which is sensitive to a component of the magnetic field generated by the current flowing through the current conductor running perpendicularly to the surface of the semiconductor chip. The first and second electrical terminals are arranged at a first side of the housing, the third electrical terminals are arranged at a side of the housing opposite to the first side. The semiconductor chip is mounted as flip chip. The semiconductor chip comprises first bumps, which make electrical connections to the third terminals, and second bumps located above the current conductor and electrically separated from the semiconductor chip by an isolation layer.

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Lausanne, Switzerland

Mathieu Ackermann