Rohde and Schwarz Gmbh & Co. Kg

Mathias Nagel

Christian Pinta

Gerd Hechtfischer

Bertrand Thomas

Achim Walber

A high-frequency substrate contains a carrier substrate, which has at least one fastening element. The fastening element is deposited on the outer region of the carrier substrate and protrudes over the outer region of the carrier substrate.

High-frequency substrate and manufacturing method for high-performance, high-frequency applications

A substrate-based circuit () provides a carrier substrate (), wherein a bond layer () is embodied on at least one part of the carrier substrate (), and wherein a contact layer () which forms at least one conductor line () and/or at least one antenna element () is embodied on at least one first part () of the bond layer (). The carrier substrate () provides at least one fastening element (), which is deposited at the outer region of the carrier substrate () and projects beyond the outer region of the carrier substrate ().

Growing community of inventors

Munich, Germany

Mathias Nagel