Amazon Technologies, Inc.

Kulicke and Soffa Industries, Inc.

Mathias Moser

Timothy G Dietz

Parris S Wellman

Beth A Marcus

Gregory Coleman

Leonard Thomas Lilliston, Iii

Manikantan Nambi

Erica Aduh

Margaret Jean Williams George

Fabian Schneider

Jonas Eichenberger

Dominique Ernst

Andreas Marte

Ueli Schlaepfer

Daniel Buergi

Urban Ernst

Alexander Holzer

Eirini Kakkava

A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.

Die bonding systems, and methods of using the same

Aspects described herein include an end effector capable of prehending items using impactive and astrictive forces. The end effector includes an interface system having a deformable mounting plate and a pliable body member attached to the mounting plate. The end effector further includes a linkage system between a plurality of actuators and the interface system. The linkage system connects to lateral portions of the mounting plate.

Linkage system for prehending objects using impactive forces

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Zurich, Switzerland

Mathias Moser