Infineon Technologies Ag

Mathias Kiele-Dunsche

Tomas Manuel Reiter

Andrea Carletti

Christopher Roemmelmayer

Pawan Garg

A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface.

Semiconductor module with package extension frames

In accordance with an embodiment, a circuit includes a switch coupled between a first reference terminal and a first output terminal, an inductive element coupled between an input terminal and a second output terminal, and a diode coupled between the first output terminal and the input terminal. The circuit further includes a controller coupled to a control terminal of the switch. The controller is configured to determine a switching signal based on an output signal at the second output terminal and provide the switching signal to the control terminal of the switch.

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Neubiberg, Germany

Mathias Kiele-Dunsche