Infineon Technologies Ag

Infineon Technologies Austria Ag

Mathias Hans-Ulrich Alexander Von Borcke

Thorsten Meyer

Markus Zundel

Uwe Schmalzbauer

Markus Winkler

A semiconductor device has a substrate having a plurality of neighboring trenches, and a contact area, one mesa stripe each being formed between two neighboring trenches. The contact area contacts mesa stripes and surrounds an opening region in which the contact area is not formed and which is formed such that the contact area contacts the same mesa stripes at two positions between which the opening region is arranged, and the opening region having a region of elongate extension which intersects the mesa stripes in a skewed or perpendicular manner.

Semiconductor device and method of manufacturing a semiconductor device

A method for setting a reference potential of a current sensor in a power semiconductor device is disclosed. On the basis of a specific geometry and a typical two-dimensional potential distribution of the power semiconductor device, a plurality of tapping points is predetermined on an area of the power semiconductor device. On the basis of the specific geometry of the power semiconductor device, a line course between the tapping points and a measuring point for measuring a potential average value is determined and realized. Respective potential values are detected at the tapping points and fed to the measuring point. The potential average value is determined at the measuring point. The potential of the current sensor is set to the potential average value thus determined.

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Munich, Germany

Mathias Hans-Ulrich Alexander Von Borcke