Sika Technology Ag

Mathias Cordes

Kai Paschkowski

Doreen Janke

Dirk Urbach

A hot-melt glue composition, including a) at least one atactic poly-&#x3b1;-olefin (APAO) that is solid at 25&#xb0; C.; b) at least one hydrocarbon resin having a softening point of at least 80&#xb0; C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150&#xb0; C., measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt %. The hot-melt glue composition is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. The hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction.

Polyolefin hot-melt glue having a low reactivation temperature and high heat stability and use thereof for vacuum deep-drawing lamination

A moisture-cured hot-melt adhesive can be formulated as a PUR-HM that is R-40 classification-free and stable during storage and processing, having a residual monomer content of less than 1 wt. % and having good cross-linking density and full-curing speed. The hot-melt adhesive is particularly suitable for vehicle construction in industrial manufacture, in particular of automobiles, in the textile or furniture industry or in the packaging industry.

Polyurethane hot-melt adhesive having a low content of diisocyanate monomers and good cross-linking speed

The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic, silane-grafted poly-&#x3b1;-olefin which is solid at 25&#xb0; C. and at least one soft resin having a melting point or softening point between &#x2212;10&#xb0; C. and 40&#xb0; C. These hotmelt adhesive compositions are suitable in particular as laminating adhesives and, even in thin layers, have an extended open time but nevertheless build up a high early strength rapidly and lead to a heat-stable adhesive bond.

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Hamburg, Germany

Mathias Cordes