Robert Boschgmbh

Mathias Bruendel

Ricardo Ehrenpfordt

Ulrike Scholz

Frieder Haag

Ando Feyh

Christina Leinenbach

Frederik Ante

Andre Gerlach

Sonja Knies

Johannes Kenntner

Jochen Rupp

Jens Frey

Fabian Henrici

Jens Grimminger

Daniel Pantel

Lutz Rauscher

Rolf Speicher

Juergen Fritz

A sensor device for contacting first and second contact points of an electrochemical energy store which are situated inside a housing of the electrochemical energy store includes: a first terminal contact for the electrically conductive connection of the sensor device to the first contact point, a first terminal material on a surface of the first terminal contact corresponding to at least a first contact material on a surface of the first contact point; and a second terminal contact for the electrically conductive connection of the sensor device to the second contact point, a second terminal material on a surface of the second terminal contact corresponding to at least a second contact material on a surface of the second contact point.

Sensor device for an electrochemical energy store, electrochemical energy store, method for manufacturing a sensor device for an electrochemical energy store

A sensor comprises a sensor element configured to provide a sensor signal representing at least one measurand detected by the sensor element, an electrical circuit configured to process the sensor signal to form a data signal, a photovoltaic cell configured to provide electrical energy for the sensor element and the electrical circuit, and a housing, in which the sensor element, the electrical circuit and the photovoltaic cell are positioned, the housing including a recess in which the photovoltaic cell is positioned, and a rim surrounding the recess and protruding beyond the photovoltaic cell. A method is also provided.

Sensor and method for producing a sensor

A photovoltaic module has at least one solar cell having an irradiation surface for receiving light. The photovoltaic module is configured to provide a voltage. The photovoltaic module also includes a carrier unit which is arranged laterally offset from the solar cell at least on one side. A first surface of the carrier unit is oriented flush with the irradiation surface of the solar cell within a predefined tolerance range. The photovoltaic module also includes at least one electrical conductor, which contacts a carrier contact connection on a second surface of the carrier unit opposite the first surface via a cell contact connection of an electronic component on the solar cell or the solar cell in an electrically conductive manner. The cell contact connection is arranged on a contacting side of the solar cell opposite the irradiation surface.

Photovoltaic module and method for producing a photovoltaic module

A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate, at least one circuit chip mounted on the substrate, and an enveloping package in which the circuit chip is packaged. The functional apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement having a plurality of micromechanical loudspeakers, which is mounted on the enveloping package. A covering device is mounted above the micromechanical functional arrangement, particularly the loudspeaker arrangement, opposite the enveloping package. A method is implemented to manufacture the micromechanical functional apparatus.

Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture

A micromechanical functional apparatus, particularly a loudspeaker apparatus, includes a substrate having a top and an underside and at least one circuit chip mounted on the underside in a first cavity. The apparatus further includes a micromechanical functional arrangement, particularly a loudspeaker arrangement, having a plurality of micromechanical loudspeakers mounted on the top in a second cavity. A covering device is mounted above the micromechanical functional arrangement on the top. An appropriate method is implemented to manufacture the micromechanical functional apparatus.

A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.

Microfluidic system for purposes of analysis and diagnosis and corresponding method for producing a microfluidic system

An electrical circuit includes a solar cell that has a photovoltaically active front side and a back side. An electronic or micromechanical component is arranged on the back side of the solar cell and is electrically connected to the photovoltaically active front side of the solar cell by a contact-making structure. The electrical circuit also includes a transparent first protective layer that is arranged on the photovoltaically active front side of the solar cell. The contact-making structure has a first contact-making section that is arranged on a front side of the first protective layer facing away from the solar cell.

Electrical circuit and method for producing an electrical circuit

A MEMS chip package includes a first chip, a second chip, a first coupling element, and a first redistribution layer. The first chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The second chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The first coupling element couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip. The first redistribution layer is mounted on the second chip surface of the second chip and is configured to provide contact with a substrate.

MEMS chip package and method for manufacturing an MEMS chip package

A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.

Method for producing a two-chip assembly and corresponding two-chip assembly

A method for producing semiconductor components and a component obtainable by such a method is disclosed. The method comprises the following steps: fixing a conductive film on a carrier; adhesively bonding semiconductor chips onto the conductive film using an adhesive layer, wherein active surfaces of the semiconductor chips, the active surfaces having connection contacts, are situated on that side of the chips which faces the film; overmolding the chips adhesively bonded onto the conductive film with a molding compound; and releasing the conductive film with the overmolded chips from the carrier. In this case, the adhesive layer is structured in such a way that at least connection contacts of the semiconductor chips are free of the adhesive layer and are kept free of the molding compound.

Method for producing semiconductor components, and corresponding semiconductor component

A method for producing a microfluidic system, containing at least one microfluidic component having at least one microfluidically active surface is disclosed. The method includes providing a microfluidic composite substrate having a connection side, comprising at least one microfluidic component introduced into a polymer composition, wherein the microfluidically active surface of said component forms a part of the connection side of the microfluidic composite substrate. The method further includes providing a mating substrate having a connection side for connection to the microfluidic composite substrate. Also, the method includes providing microfluidic structures at least on the connection side of the composite substrate and/or on the connection side of the mating substrate at least for the purpose of forming a microfluidic channel structure in the microfluidic system. In addition, the method includes connecting the microfluidic composite substrate and the mating substrate by their connection sides to form a microfluidic channel structure.

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Stuttgart, Germany

Mathias Bruendel