Cadence Design Systems, Inc.

Synopsys, Inc.

Mathew Koshy

Roland Ruehl

Udayan Anand Gumaste

Baribrata Biswas

David Allan White

Arthur Nieuwoudt

Tianhao Zhang

Li-Ling Ma

Jiyoun Kim

Charles C Chiang

Eitan Cadouri

Min Cao

Xiaojun Wang

Jonathan R Fales

Harsh Deshmane

Beifang Qiu

Haifang Liao

Krzysztof Antoni Kozminski

Xu Zhu

Xinming Tu

Qiushi Chen

Xiaoping Hu

A method and apparatus to provide a capacitance to a design an integrated circuit is described. In one embodiment, the method receive a layout of the integrated circuit and applying canonical hierarchical models to the layout, wherein the canonical hierarchical models include a first type canonical model to capture a first capacitance of a device having a plurality of first conductors and a second type canonical model to capture a second capacitance between at least a portion of the device and one or more second conductors of the integrated circuit. The method further includes determining a capacitance for the layout based on the applying.

Capacitance extraction for advanced device technologies

A technology specific information to design the integrated circuit is received. A plurality of canonical hierarchical models to capture an integrated circuit capacitance are created. The plurality of canonical hierarchical models includes at least a canonical model to capture a capacitance of a device having a plurality of conductors, and a canonical model to capture a capacitance between at least a portion of the device and one or more other conductors of the integrated circuit. The canonical hierarchical models can be applied to a layout of the integrated circuit. A capacitance for the layout can be determined based on the canonical hierarchical models.

Disclosed is a method and system for processing the tasks performed by an IC layout processing tool in parallel. In some approaches, the IC layout is divided into a plurality of layout portions and one or more of the layout portions are processed in parallel, where geometric select operations are performed in which data for different layout portions may be shared between different processing entities. One approach includes the following actions: select phase one operation for performing initial select actions within layout portions; distributed regioning action for local regioning; distributed regioning action for global regioning and binary select; count select aggregation for count-based select operations; and select phase two operations for combining results of selecting of internal shapes and interface shapes.

Method and system for parallel processing of IC design layouts

One embodiment of the present invention provides a system that performs an RLC extraction for a three-dimensional integrated circuit (3D-IC) die. During operation, the system receives a 3D-IC die description. The system then transforms the 3D-IC die description into a set of 2D-IC die descriptions, wherein the transform maintains equivalency between the set of 2D-IC die descriptions and the 3D-IC die description. Next, for each 2D-IC die description in the set of 2D-IC die descriptions, the system performs an electrical property extraction using a 2D-IC extraction tool to obtain a 2D-IC RLC netlist file. The system then combines the set of 2D-IC RLC netlist files for the set of 2D-IC die descriptions to form an RLC netlist file for the 3D-IC die description.

Method and apparatus for performing RLC modeling and extraction for three-dimensional integrated circuit (3D-IC) designs

In random defect yield simulation, a specific defect size interacts with a specific physical design and has a calculated probability of failure associated with it. The failure model is in terms of probability of failure. It provides a solution to the random defect yield simulation problem of chips with a built-in redundancy scheme. The solution first defines the independent failure modes of the chip with a built-in redundancy scheme and efficiently models each mode. Then, it may accumulate the respective probability of failures according to the chip's architecture.

System and method for random defect yield simulation of chip with built-in redundancy

The present invention presents a hybrid approach for manufacturability analysis that integrates both a rules-based approach and a models-based approach. For example, a rules-based analysis can be used to optimize the performance of a model-based analysis. The rules analysis can be used to identify specific areas of a layout that can then be analyzed in detail using models. This approach provides numerous advantages. It allows the models-based analysis tool to concentrate upon portions of the layout that requires greater attention and allocate fewer resources towards the areas less critical to the yield.

System and method for using rules-based analysis to enhance models-based analysis

Methods and systems for integrating both models and rules into a verification flow to address both of these issues. Models are employed to perform simulations to provide more accurate verification results. In addition, the lithography simulation results can be used to fine-tune the rules themselves to provide a more realistic check upon circuit designs.

System and method for performing verification based upon both rules and models

Methods and systems for the integration of models and accurate predictions to score the circuit design, which translates to a more accurate and less complex yield prediction. In the present inventive approach, the computer-implemented methods and systems use at least one processor that is configured for performing at least predicting a physical realization of a layout design based at least in part on one or more model parameters, determining one or more hotspots associated with the layout design, determining a score for each of the one or more hotspots associated with the layout design, and categorizing the one or more hotspots according to at least the score in some embodiments. In some embodiments, the methods or the systems further use at least one processor for the act of determining one or more hotspots by using at least the design intent or the manufacturing information.

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San Mateo, CA, United States of America

Mathew Koshy