Murata Manufacturing Co., Ltd.

Masuyoshi Houda

Masaya Wajima

Nobumichi Kimura

Takahiro Matsumoto

A method for manufacturing a terminal-strip-equipped electronic component in which terminal strips made of a metal plate are bonded with solder to terminal electrodes of an electronic chip component on two opposing end surfaces. Solder cream is applied to outer surfaces of the terminal electrodes. The terminal strips are thermocompression bonded to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to obtain an electronic component to which the terminal strips are temporarily fixed. The terminal strips are fully fixed to the electronic component by melting the solder cream as a result of heating the electronic component in a heating furnace so as to obtain a terminal-strip-equipped electronic component.

Method for manufacturing terminal-strip-equipped electronic component and terminal-strip-equipped electronic component

A method of forming a groove on a mother material substrate includes the steps of forming a first layer on a surface of the mother material substrate, the first layer including a chain-polymer material which is soluble in an organic solvent. Then a second layer is formed on the first layer except for a portion where the groove is to be formed. The second layer includes a chain-polymer material having very high resistance to sand blasting. Then a groove is formed by cutting the first layer and the mother material substrate at the portion where the groove is to be formed, by a sand blasting process in which sand is directed from above the second layer downwardly. Then the first and second layers are removed from the mother material by dissolving the first layer using the organic solvent.

Method of forming a groove in a surface of a mother substrate

A method of manufacturing a chip type electronic component includes the steps of forming a multilayer body including a major surface and a side surface by laminating a plurality of substrates and at least one internal electrode interposed between two of the substrates, forming a groove between the two substrates at the side surface of the multilayer body so as to expose an end of the at least one internal electrode, and making the side surface of the multilayer body rough by performing barrel polishing on the multilayer body, the barrel polishing being performed in a barrel pot in which water, media, an abrasive powder and the multilayer body are provided and forming an external electrode on the side surface of the multilayer body, the external electrode being connected to the end of the internal electrode exposed at the groove.

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Toyama, Japan

Masuyoshi Houda