Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Masuo Masui

Ken Takahashi

Eigo Sarashina

Yoshihiko Misawa

Yoshinori Isobata

Hiroshi Okamura

Akira Iizuka

Toshio Yano

Takao Naito

Naoichi Chikahisa

Yoshiyuki Hattori

Satoshi Nonaka

Masaru Nonomura

Hitoshi Nakamura

Akio Inomata

A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.

Component mounting apparatus, service providing device and servicing method

A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.

A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.

Component mounter, service supplier, and service supplying method

In a printing device in which a printing material is printed on or applied to a to-be-printed surface of a circuit board through a screen mask for printing having openings formed therein in a predetermined pattern, it is intended to reliably remove cream solder remaining in the openings in the screen mask. After an air suction mechanism (,) has its flow rate controlled by a flow rate controller (,). An air suction section (,) is lifted until its front end contacts with the screen mask (,), the air suction mechanism (,) starts cleaning by sucking air from the openings (,) in the screen mask (,). An inspecting camera (,) is used to observe the cream solder (,) remaining in the openings (,) after cleaning, and the air suction flow rate is controlled according to the results thereof to effect cleaning again.

Cleaning apparatus and cleaning method

Reflow soldering device

Growing community of inventors

Yamanashi, Japan

Masuo Masui