Canon Kabushiki Kaisha

Masumitsu Iwata

Noboru Toyama

Yusuke Miyamoto

Yuichi Sonoda

Takaharu Kondo

Ryo Hayashi

Hideo Tamura

Akiya Nakayama

Atsushi Yasuno

Satoru Yamada

Yasuyoshi Takai

Hidetoshi Tsuzuki

Tomonori Nishimoto

A robot includes an input detection portion, a motion detection portion, and a control portion. The input detection portion is configured to detect an input given from an operator to a robot body. The motion detection portion is configured to detect a motion by using the input detection portion, the motion being given by the operator. The control portion is configured to execute a motion instruction associated with the motion detected by the motion detection portion.

Robot, control device, and information processing device

To allow a robot body to quickly resume operation, using simple control, when a main power supply is restored after a failure. A calculation unit divides a series of operations of the robot body into a plurality of operation blocks in advance and causes the robot body to perform operations sequentially from one operation block to another using power supplied from the main power supply (Sto S). The calculation unit causes the robot body to continue operation using the power supplied from an auxiliary power supply, even if the main power supply fails, until the operation block being processed at the time of the failure of the main power supply out of the plurality of operation blocks is finished (S). The calculation unit causes the robot body to stop operation, when the operation block being processed at the time of the failure of the main power supply is finished, until the main power supply is restored from the failure (S). When the main power supply is restored from the failure, the calculation unit causes the robot body to resume operation beginning with an operation block next to the operation block caused by the calculation unit to be performed by the robot body in the process of step S(S, S, and S).

Robot controlling apparatus and robot controlling method

A method of forming a laminate and a method of manufacturing a photovoltaic device using the laminate are provided. The laminate forming method includes a first step of forming an intermediate layer on a base member, and a second step of forming a metal layer on the intermediate layer, the adhesion of the metal layer to the base member being lower than that of the intermediate layer, the reflectance of the metal layer being higher than that of the intermediate layer. The rate of formation of the metal layer is increased at an intermediate stage in the second step. The laminate thereby formed has improved characteristics and is capable of maintaining improved reflection characteristics and adhesion even under high-temperature and high-humidity conditions or during long-term use.

Method of forming laminate and method of manufacturing photovoltaic device

A film of zinc oxide electrochemically deposited from an aqueous solution is subjected to heat treatment at a temperature equal to or higher than 150&#xb0; C. and equal to or lower than 400&#xb0; C. in a nitrogen or inert gas atmosphere that contains oxygen, thereby obtaining a zinc oxide film that is low in electric resistance without impairing the light transmittance of the zinc oxide film.

Zinc oxide film treatment method and method of manufacturing photovoltaic device utilizing the same

A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive. By holding the conductive portion of the film-deposition suppression device and the conductive substrate at substantially the same potential, film deposition on the other surface of the conductive substrate is suppressed.

Growing community of inventors

Kyoto, Japan

Masumitsu Iwata