Sharp Kabushiki Kaisha Corporation

Masumi Maegawa

Katsuji Iguchi

Hitoshi Aoki

Toshiya Ishio

Takanobu Matsuo

Keiichi Sawai

Hiroyoshi Higashisaka

Takashi Kurisu

An N electrode and a P electrode formed on the same surface are respectively bonded to a cathode electrode and an anode electrode of a drive circuit board through a connection step performed once. An LED unit includes a first wiring () that is disposed inside a groove formed in a nitride semiconductor () to penetrate between an N-type layer () and a P-type layer () and is electrically connected to the N-type layer (), and a second wiring that includes a P electrode () connected to the P-type layer () and an N electrode () connected to the first wiring (), in which the N electrode () and the P electrode () are formed on the same surface.

LED unit, image display element, and method of manufacturing the same

In a micro light emitting element, a first metal film electrically connected to a second conductive layer is disposed on a surface on an opposite side of a light emitting surface side. The first metal film covers the second conductive layer. A first inclined angle of a first conductive layer side surface from a slope formed around a light emission layer to the light emitting surface is larger than a second inclined angle of the slope. The slope and the first conductive layer side surface are covered together by a second metal film. A first transparent insulating film is disposed between the slope and the second metal film.

Image display element

An image display device includes: a plurality of LED elements that are mounted on a drive circuit substrate and emit light source light; a wavelength conversion layer that is stacked on a side of the LED elements opposite to the drive circuit substrate, converts the light source light emitted by the LED elements into long wavelength light, and emits the long wavelength light to a side opposite to the drive circuit substrate; and a first functional layer that is disposed on a light emitting surface side of the long wavelength light of the wavelength conversion layer, reflects the light source light, and transmits the long wavelength light.

Image display device

Bonding equipment includes a laminar flow source, a chip handling portion, a cleaning portion for cleaning a chip, a bonding portion for bonding the chip and a substrate, and a transfer mechanism for transferring the chip from the chip handling portion to the bonding portion. Among these, at least the bonding portion and the cleaning portion are disposed in a laminar flow by the laminar flow source.

Growing community of inventors

Sakai, Japan

Masumi Maegawa