Tdk Corporation

Masumi Kameda

Atsushi Sato

Hisayuki Abe

Takashi Ota

Miyuki Yanagida

Kenichi Kawabata

Shuichi Takizawa

Hiroki Hara

Shigeru Asami

Seiichi Tajima

An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Electronic circuit module component and method of manufacturing electronic circuit module component

The present invention provides a terminal structureincluding a terminalhaving a conductorcontaining at least one metal selected from the group consisting of gold, silver, and copper, a first layer containing phosphorus and nickel disposed on the conductor, and a second layer having a nickel/phosphorus atomic ratio smaller than that of the first layer and containing NiP disposed on the first layer; and solderdisposed on the second layer of the terminal, while the second layer has a thickness of at least 0.35 &#x3bc;m; and a module substratehaving the terminal structure.

Terminal structure, printed wiring board, module substrate, and electronic device

The present invention provides a plating filmincluding a nickel plating layer containing phosphorus and a gold plating layer formed on the nickel plating layer, wherein the nickel plating layer has a phosphorus content of 11 to 16 mass %, and wherein (3&#xd7;&#x3c3;&#xd7;100)/X is 10 or less, where X and &#x3c3; are the average value and standard deviation of the phosphorus content in a surface of the nickel plating layer on the gold plating layer side, respectively; and a module substratehaving the plating film

Plating film, printed wiring board, and module substrate

Growing community of inventors

Tokyo, Japan

Masumi Kameda