Ube Industries, Inc.

Masuaki Ichikawa

Akio Miyamoto

Tetsuya Yasui

Yutaka Matsudomi

Hiroki Akatsu

The present invention relates to a polyamide resin composition, which not only demonstrates superior mechanical properties but also has favorable moldability and superior thermal conductivity, wherein the polyamide resin composition comprises (A) a polyamide resin, (B) glass fibers, (C) a thermally conductive filler, and (D) a polyamide elastomer, and the amount of the component (B) based on 100 parts by mass of the total amount of the components (A), (B), (C) and (D) is 9 parts by mass to 35 parts by mass; and, a molded article comprising the same.

Polyamide resin composition and molded article comprising same

A polyamide resin composition containing a polyamide resin (A) and a property imparting component. The composition comprises relative to 100 parts by volume of the polyamide resin (A), as the property imparting component, 50 to less than 100 parts by volume of flake graphite (B), 5 to 40 parts by volume of carbon fibers (C), and 0.1 to 5 parts by volume of a polyhydric alcohol (D).

Polyamide resin composition and molded article comprising the same

A polyamide resin composition comprising defined amounts of flake graphite, carbon fibers, and polyhydric alcohol. A polyamide resin composition comprising a polyamide resin and, as a property imparting component, at least one member selected from the group consisting of a metal oxide, a nitrogen compound, and a silicon compound, wherein a defined amount of the dicarboxylic acid units of the polyamide resin are oxalic acid. A polyamide resin composition comprising a polyamide resin and a defined amount of metal oxide particles, wherein the metal oxide particles contain those having a particle size of 70 &#x3bc;m or more in an amount of 10 to 50% by mass and those having a particle size of 20 &#x3bc;m or less in an amount of 1 to 50% by mass, based on the total mass of the metal oxide particles.

Growing community of inventors

Ube, Japan

Masuaki Ichikawa