Sika Technology Ag

Massimo Demarco

Lester Hensley

Eric Muench

Disclosed is a safer, dustless method for installing an expansion joint sealing system without mechanically grinding substrates to improve adhesion. The method includes locating substrates forming a gap between opposing surfaces of the substrates, preparing the surfaces by wiping with a solvent, and applying a mounting band of sealant to the surfaces. The method includes disposing the sealing system in the gap proximate to or within the mounting band, maintaining the sealing system in the gap until the system expands toward the surfaces, embeds within the mounting band and secures the sealing system in position between opposing surfaces. The method also includes prior to the preparing the surfaces, removing an existing joint sealing system by cutting sealant between the existing system and the substrates, wiping surfaces with solvent, and leaving any deformation or embedded residue from the removed sealing system on or embedded in the surfaces of the substrates.

Growing community of inventors

Woodbridge, Canada

Massimo Demarco