Texas Instruments Corporation

Octavo Systems LLC

Masood Murtuza

Satyendra Singh Chauhan

Gene A Frantz

Rajiv Carl Dunne

Charles Anthony Odegard

Peter Robert Linder

Gary Paul Morrison

Marvin Wayne Cowens

Vinu Yamunan

Phillip R Coffman

Thomas Dyer Bonifield

Erik James Welsh

Christopher Lloyd Reinert

Matthew David Romig

Siva Prakash Gurrum

Darvin R Edwards

Yoshimi Takahashi

Muthiah Venkateswaran

Kazunori Hayata

Prema Palaniappan

Neeraj Kumar Reddy Dantu

Michael Kenneth Conti

Donald Charles Abbott

William Arthur Fitzhugh Lee

David N Walter

Navinchandra Kalidas

William Kevin Dennis

Raymond W Thompson

Abbas I Attarwala

Anthony B Murphy

Guangneng Zhang

Methods and structures for manufacturing one or more System in a Package (SiP) devices, where the functionality of a packaged SiP device may be modified by additional components.

System in a package modifications

A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.

Secure enclave system-in-package

High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.

High performance module for SiP

A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.

System and method of assembling a system

Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.

EMI shield for molded packages

A System in a Package (SiP) device is provided with an interconnect area or a physical space on a main SiP substrate that allows for a customizable second packaged component or device to be externally interconnected with the components on the main substrate of a packaged SiP to allow for modifications to the functionality of the components and devices on a primary (or main) SiP substrate.

System in a package connectors

The present disclosure describes a service module for a System in a Package (SiP) device. This includes methods of manufacture, use, and testing relating to the same.

Service module for SIP devices

Systems and devices for enabling the use of SIP subsystems to make a configurable system having a unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems such that desired characteristics and features for the configurable system are provided.

Configurable substrate and systems

Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.

Method for routing bond wires in system in a package (SiP) devices

Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.

Circuit mounting structure and lead frame for system in package (SIP) devices

Substrate for system in package (SIP) devices

A fixture for securing at least one test printed circuit board assembly (PCBA) including a PCB having semiconductor devices mounted thereon during vibration or mechanical shock testing. A top plate includes top features including a continuous top outer ring, at least one inner top aperture within the top outer ring, and a plurality of outer top apertures positioned beyond the top outer ring including a top probe access aperture and a threaded aperture. A bottom plate includes bottom features including a bottom continuous outer ring, at least one inner bottom aperture, and plurality of outer bottom apertures including a bottom probe access aperture and table mounting aperture. The threaded apertures accept a fastener that clamps the top plate to the bottom plate for the outer rings to secure a full periphery of the PCB between the top plate and bottom plate.

Fixture for test circuit board reliability testing

In fabricating a semiconductor device first layers are formed of sintered bondable and solderable metal on a carrier strip. The first layers are patterned into first pads and second pads. A set of first pads is surrounding each second pad. The first pads are spaced from the second pad by gaps. The patterned layers are formed of agglomerate metal vertically on the first layers of sintered bondable and solderable metal of the first pads and of the second pad. The second layers are formed of sintered bondable and solderable metal vertically on the layers of agglomerate metal of the first pads.

Growing community of inventors

Sugar Land, TX, United States of America

Masood Murtuza