Cisco Technology, Inc.

Hadco Santa Clara, Inc.

Mason Hu

Mudasir Ahmad

Nicholas Biunno

Scott K Bryan

David Anthony Popovich

Robert Pattison

A device, apparatus and printed circuit board assembly for removably coupling an electrical component with a PCB are described, which provides adequate electromechanical capability, is relatively insensitive to related heating, component removability, replacability and reworkability while minimizing wear and the possibility of resizing and damage. The device includes a sleeve for coupling with a component pin, which encloses the pin and further couples to a conductive barrel interconnecting multiple PCB layers. The sleeve conforms upon insertion within the barrel to its contour. A flange at an end of the sleeve deters over-insertion. The coupling so formed can be gas-tight.

Device, apparatus, method and assembly for coupling an electrical component with a circuit board

A method of forming a subassembly for use in a printed circuit board is described. This method includes providing a subassembly including a circuit board layer laminated to two sheets of conductive material with two intermediate sheets of prepreg material, forming a via in the assembly, plating the via, filling the via with a plug material in a volatile solvent, evaporating the volatile solvent, and curing the plug material. Also described is a method of forming a partially filled via in a circuit board layer and a method of forming a thermally conductive plug in a circuit board layer for the transfer of thermal energy from one surface of the circuit board to the other.

Forming plugs in vias of circuit board layers and subassemblies

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Cupertino, CA, United States of America

Mason Hu