Hitachi Metals, Ltd.

Neomax Materials Co., Ltd.

Masayuki Yokota

Masaharu Yamamoto

Fumiaki Kikui

Ken Asada

Ryoji Inoue

Masaaki Ishio

Yoshimitsu Oda

Kazuhiro Shiomi

Kouji Kawahara

Masaru Fujiyoshi

Yoshiharu Tsuboi

Naruaki Tomita

The method manufactures a hermetic sealing lid member used for an electronic component housing package including an electronic component arrangement member on which an electronic component is arranged. The method includes forming a clad material in which a silver brazing layer that contains Ag and Cu and a first Fe layer arranged on the silver brazing layer and made of Fe or an Fe alloy are bonded to each other by roll-bonding a silver brazing plate that contains Ag and Cu and a first Fe plate made of Fe or an Fe alloy to each other and performing first heat treatment for diffusion annealing; softening the clad material by performing second heat treatment; and forming the hermetic sealing lid member in a box shape including a recess portion by bending the softened clad material.

Method for manufacturing hermetic sealing lid member

This glass bonding material () is made of a cladding material () in which at least a first layer () made of an Al-based alloy and configured to be bonded to glass and a second layer () made of an Fe&#x2014;Ni based alloy having a thermal expansion coefficient from 30&#xb0; C. to 400&#xb0; C. of 11.5&#xd7;10(K) or less are bonded.

Glass bonding material and multilayer glass

This hermetic sealing lid member () is made of a clad material () including a silver brazing layer () that contains Ag and Cu and a first Fe layer () bonded onto the silver brazing layer and made of Fe or an Fe alloy. The hermetic sealing lid member is formed in a box shape including a recess portion () by bending the clad material.

Hermetic sealing lid member

This method for manufacturing a hermetic sealing lid member () includes forming a Ni plated metal plate () by forming a Ni plated layer () on a surface of a metal plate () having a corrosion resistance and forming the hermetic sealing lid member by punching the Ni plated metal plate.

Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package

A battery terminal is made of a clad material in which a first metal layer made of an Al-based alloy, a second metal layer made of a Cu-based alloy, and a third metal layer made of a Ni-based alloy are bonded to each other in a state where the first metal layer, the second metal layer, and the third metal layer are stacked in this order. The battery terminal includes a shaft portion and a flange portion that radially expands from the shaft portion, and has the third metal layer at least in an end of the shaft portion on a first side in a shaft direction in which the shaft portion extends.

Battery terminal and method for manufacturing battery

A separator for a fuel cell according to the present invention includes: a basecontaining 70 mass % or more of Al; an underlying layerbeing formed on the base and containing Ti; an intermediate layerbeing formed on the underlying layer and containing TiNx or TiOy; and a conductive metal layerbeing formed on the intermediate layer and containing Au or Pt. The separator for a fuel cell according to the present invention has an excellent anticorrosiveness although a base containing aluminum as a main component is used.

Fuel cell separator and method for producing the same

An electroless Ni&#x2014;P plating method according to the present invention includes the steps of: providing a substrate including an insulating substrate and a copper alloy layer that has a predetermined pattern including a plurality of island portions that are isolated from each other; providing a plating solution to carry out electroless Ni&#x2014;P plating; providing a solid piece including Ni, Ni&#x2014;P, Co or Co&#x2014;Ni on at least the surface thereof; and bringing the solid piece into contact with the surface of at least two of the island portions that are both in contact with the plating solution, thereby selectively forming an electroless Ni&#x2014;P plated coating on the surface of the island portions. Thus, the present invention provides a Ni&#x2014;P plating method that can subject the copper pattern on the insulating substrate to high-precision selective Ni&#x2014;P plating on an industrial basis.

Electroless Ni-P plating method and substrate for electronic component

A Cu&#x2014;Mo substrateaccording to the present invention includes: a Cu basecontaining Cu as a main component; an Mo base having opposing first and second principal facesand containing Mo as a main component, the second principal faceof the Mo basebeing positioned on at least a portion of a principal faceof the Cu base; and a first Sn&#x2014;Cu-type alloy layercovering the first principal faceand side facesandof the Mo base, the first Sn&#x2014;Cu-type alloy layercontaining no less than 1 mass % and no more than 13 mass % of Sn.

Growing community of inventors

Suita, Japan

Masayuki Yokota