Hitachi Chemical Company, Ltd.

Masayuki Wada

Junichi Kamei

Tetsuya Okazaki

Youichi Kimura

Shunrin Ryuu

Provided is a liquid curable resin composition containing (A) a polymer component containing (A1) a polymer having an ethylenically unsaturated bond in a molecule thereof; (B) a low-molecular weight monomer having one ethylenically unsaturated group in a molecule thereof; and (C) a polymerization initiator, wherein the component (B) contains a compound represented by the following general formula (I). The liquid curable resin composition may be a material which is suitably applicable for the purpose of filling a space between a protective panel and an image display unit or the like in a large-sized image display device and which is excellent in moist heat resistance reliability.  (In the formula, Rrepresents a hydrogen atom or a methyl group; Rrepresents an alkyl group having 4 or more carbon atoms; and n represents a number of from 1 to 20.)

Growing community of inventors

Ibaraki, Japan

Masayuki Wada