C.uyemura Co., Ltd.

Masayuki Utsumi

Hisamitsu Yamamoto

Yoshikazu Saijo

Tomoji Okuda

Teruyuki Hotta

Takahiro Ishizaki

Daisuke Matsuyama

Masaharu Takeuchi

Nobuhiko Naka

Takuya Okamachi

Junji Mizumoto

Takuya Komeda

Yutaka Nishinaka

Syunsaku Hoshi

Yoshinori Nakanishi

Kouji Shimizu

Shinji Tachibana

Fujio Asa

Hiroki Omura

Tetsuji Ishida

Masahito Tanigawa

Masato Aratani

A surface treatment apparatus for subjecting a workpiece immersed at least partly in a solution to a surface treatment has: a spray nozzle facing the workpiece for spraying a treatment solution towards a working surface of the workpiece. The surface treatment apparatus has at least one of: a spray nozzle rotator to rotate the spray nozzle in a plane parallel to the working surface of the workpiece; or a workpiece rotator to rotate the workpiece in a plane perpendicular to a spraying direction of the treatment solution sprayed from the spray nozzle.

Surface treatment apparatus and surface treatment method

In a flow down type surface treating apparatus, a scattering amount of a processing solution is reduced. A film forming mechanismis provided on an inlet side and an outlet side of each treatment chamber. The film forming mechanismejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering memberfrom splashing and entering the adjacent treatment chamber. When a plate-like workis shaken to collide with the liquid film, the film flows down along the plate-like worksince the film formed by the film forming mechanismis liquid. Thereby, a shake of the plate-like workis converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.

Surface treating apparatus

To provide surface treatment that can reduce occurrence of defects caused by incorporation of dust. Rollersare rotatably fixed to rotating shaftsprovided to protrude from lateral protective walls. The lateral protective wallsare fixed perpendicularly to lower protective wallsfixed to outer walls. Hanging platesof a hangerextend through a spacebetween both lower protective wallsand support clips. A liquid, such as water, is filled in spaces defined by the lateral protective walls, the lower protective walls, and the outer walls. The liquidis filled to cover about half of each rotating shaft. Thus, fine dust generated by a transferring mechanism is captured by the liquidand prevented from drifting from the spacetoward the substrate

A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bathis rotated, partscontact an electrodeto be electroplated. In this event, a plating liquidis used as circulated by a pump P. The plating liquidis discharged to the outside through a gap in a side wallfor replacement of the plating liquidor the like. During discharge, the plating liquidis not circulated by the pump P. The gapwhich is formed in the side wallis formed to be smaller than the minimum dimension of the partson the inner side. The gapis formed to be wider toward the outer side. Thus, water is discharged immediately.

Surface treating device

In a flow down type surface treating apparatus, a scattering amount of a processing solution Q is reduced. A honeycomb memberis provided vertically below a transport hanger. The honeycomb memberconsists of a plurality of tubular members with hexagonal holes connected together. When the processing solution Q falls in a vertical direction (in the direction of an arrow &#x3b1;), the processing solution Q passes through through-holes of the honeycomb member. When the processing solution Q hits liquid level H, a part of it is reflected. Since a part of the reflected processing solution Q is reflected obliquely, it collides with an inner wall of the through-hole of the honeycomb member. As a result, the amount of the treatment liquid Q that emerges again on an upper surface of the through-holes is reduced. Thereby, the honeycomb memberexhibits a scattering prevention function.

Surface treating apparatus and surface treatment method

An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.

Ultrasonic treatment apparatus

A surface treating apparatus that suppresses occurrence of defects is provided. A treatment solution is accumulated in a tankthrough a treatment solution collecting port/air discharging portin a lower portion of a body. An air heated by the treatment solution flows toward an upper portion (portion without the treatment solution) of the tankvia the treatment solution collecting port/air discharging portin the lower portion of the body, and is discharged via an exhaust duct. In this way, the air that is heated and tends to flow upward in the bodyis discharged from the lower portion thereof and is replaced with an external air from the upper portion thereof. Accordingly, the air in the bodycan be maintained at a uniform temperature. Thus, the treatment solution that reaches a lower portion of a substratefrom an upper portion thereof can be maintained at a uniform temperature. The air is caused to flow toward the lower portion from the upper portion in the body, so that the substrateis pulled downward, and swinging of the substratecan thus be reduced. Therefore, the substratecan be less likely to contact an inletand an outlet

A drying apparatus of the present invention includes a drying tank for performing drying processing of a workpiece, a fixture for the workpiece, heating means opposed to a front surface of the workpiece, and heating means opposed to a back surface of the workpiece, wherein each heating means is inclined from a horizontal line in its longitudinal direction.

Drying apparatus

A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrateis sandwiched and held by a clipof a hanger. A pipeas a treatment solution releasing section is provided on each side of the substratethat is held by the hanger. This pipeis provided with a holefrom which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate, reaches a lower portion thereof, is circulated by a pump, and is released from the pipeagain.

The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.

Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same

A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: CH&#x2014;(OCH)&#x2014;OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: CH&#x2014;(OCH)&#x2014;OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.

An tank such as an electroless copper plating tank, includes a liquid squirting parthaving a squirt portfor squirting the processing solution Q from the squirt porttoward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like workso that the processing solution Q runs down the plate-like work

A tank bodyincludes a liquid receiving partfor receiving processing solution Q applied to a plate-like workand a liquid retaining partfor retaining liquids to be applied to the plate-like workand a liquid outflowing partfor causing a flow of the processing solution Q which is spilled out of the liquid retaining partand traveled down toward the plate-like work, wherein a tipof the liquid outflowing partis projected from a connecting partconnecting to the liquid retaining part(or the liquid receiving part).

An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion.

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Osaka, Japan

Masayuki Utsumi