Hokko Chemical Industry Co., Ltd.

Other

Nippon Paint Compnay, Ltd.

Mitsui Engineering and Shipbuilding Company Limited

Masayuki Umeno

Toshio Shiobara

Kazutoshi Tomiyoshi

Shoichi Osada

Eiichi Asano

Tatsuya Ishizaki

Kenji Ohashi

Junji Yokoi

Hitoshi Okamoto

Sumio Wakabayashi

Kazuo Tomozane

Akitomo Wakabayashi

Satoshi Takita

An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.

Semiconductor encapsulating epoxy resin composition and semiconductor device

An epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator is suited for semiconductor encapsulation. A specific organic phosphorus compound is used as the curing accelerator. The composition is smoothly flowing, stable during storage, effectively curable and mold releasable and can be molded and cured into products free from wire flow and voids.

A quaternary phosphonium hydroxide, which is represented by the following general formula (II): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 mean independently an alkyl group having 1-8 carbon atoms, a phenyl group or a benzyl group, is prepared by dissolving a quaternary phosphonium halide represented by the following general formula (I): ##STR2## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 has the same meaning as defined above and X denotes a chlorine, bromine or iodine atom, in a solvent selected from water, lower alcohols and aqueous lower alcohols, and then bringing the resultant solution into contact with a strongly basic anion exchange resin (OH-form).

Preparation process of quaternary phosphonium hydroxide

New tetraarylboron-ammonium complexes having the general formula: ##STR1## wherein R.sub.1 represents a hydrogen or a halogen atom or a lower alkyl group; R.sub.2 represents a halogen atom or a lower alkyl or a lower alkenyl group; and R.sub.3 represents a heterocyclic amine are provided as active ingredient of anti-fouling paint and also of antiseptic, antifungal agent. These compounds exhibit remarkably long-lasting anti-fouling activities against substantially all kinds of aquatic organisms including slimes with acceptably low toxicity against human beings and also exhibit high antimicrobial activities against various fungi, bacteria and yeasts.

Tetraarylboron-ammonium complexes and their uses

Growing community of inventors

Chigasaki, Japan

Masayuki Umeno