Kabushiki Kaisha Toshiba

Meiji Dairies Corporation

Meiji Co., Ltd.

Meiji Milk Products Company, Limited

Toshiba Memory Corporation

Riken Corporation

Tokyo Institute of Technology

Abe, Takashi

Masayuki Uchida

Akira Tojo

Kazuhito Higuchi

Kazuo Shimokawa

Takashi Ito

Tomohiro Iguchi

Takashi Togasaki

Daisuke Hiratsuka

Keiko Morikubo

Masashi Yamada

Hiroto Suzuki

Hajime Sasaki

Kenji Mizumoto

Munehiro Oda

Hisae Kume

Yukie Suma

Masatoshi Tanabe

Masako Fukumitsu

Yoshinori Asakawa

Seiko Narushima

Hiroshi Tsuboi

Sachiko Okabe

Natsuko Murata

Naommy Takahashi

Atsushi Nemoto

Tatsuya Kobayashi

Akio Yamashita

Masayuki Suzuki

Tadashi Iijima

Hirokazu Ezawa

Kaori Yoshida

Takashi Muramatsu

Naoki Kato

Sadatoshi Sakuma

Masahiro Miyata

Tatsuo Migita

Soichi Yamashita

Yusaku Asano

Takashi Abe

Shinya Ikematsu

Toshiya Nakayama

Yasunari Ukita

Hisashi Ito

Kazuma Hiraguri

Akihiro Sasaki

Kentaro Suga

Hiroshi Tsuchita

Hajime Tsunoo

Hideshi Kumai

Mayumi Machino

Satoru Hara

Orie Kobayashi

Kyoko Honma

Masato Sone

Hidekazu Tonouchi

Tso-Fu Mark Chang

Shigeru Yamato

Hajime Ariga

Hirotsugu Uehara

Tomofumi Amano

Kazutoshi Kiuchi

Minehiko Yokoyama

Norimichi Yoshioka

Takae Wakabayashi

The present invention relates to hot flash-suppressing agents and menopausal disorder-improving agents and a food and drink and a pharmaceutical preparation for suppressing hot flash, containing &#x3b1;-lactalbumin as an active ingredient.

Hot flash-suppressing agent

A semiconductor device includes a base, a first semiconductor chip mounted on the base, and a second semiconductor chip provided above the first semiconductor chip. The second semiconductor chip includes a first portion, a second portion including a region directly above a center of the first semiconductor chip, and a third portion including part of a portion of the second semiconductor chip other than a region directly above the first semiconductor chip. The second portion is thicker than the first portion. The third portion is thicker than the second portion and is disposed at a position sandwiching the first semiconductor chip.

Semiconductor device and method for manufacturing semiconductor device

A semiconductor device includes a base including interconnects, a first semiconductor chip including a first semiconductor element portion, and a second semiconductor chip including a second semiconductor element portion. The second semiconductor chip is electrically connected to the first semiconductor chip via at least one of the interconnects. The second semiconductor chip includes a first region, a first portion, and a second portion. The first region includes the second semiconductor element portion. The first portion is continuous with the first region. The second portion is continuous with the first region and is separated from the first portion in a second direction crossing a first direction. The first direction is from the base toward the first region. The second portion, the first portion, and at least a portion of the first semiconductor chip each is positioned between the base and the first region.

Semiconductor device, method for manufacturing semiconductor device, and method for manufacturing semiconductor package

According to one embodiment, the first end part of the first semiconductor chip in a lower stage protrudes to a larger extent in a first direction than the first end part of the first semiconductor chip in an upper stage. The second end part of the second semiconductor chip in a lower stage protrudes to a larger extent in a second direction opposite from the first direction than the second end part of the second semiconductor chip in an upper stage. The first interlayer semiconductor chip includes a first portion, a second portion, and a third electrode pad. The first portion overlaps the first chip group. The second portion protrudes in the second direction beyond the first chip group and the second chip group and is thicker than the first portion. The third electrode pad is provided on the second portion and bonded with the third metal wire.

Semiconductor device

An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.

Electroplating method and electroplating device

According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.

Metallic particle paste, cured product using same, and semiconductor device

The present inventors conducted dedicated studies, and as a result discovered that propionic acid bacteria fermentation products have a preventive/therapeutic effect on functional gastrointestinal disorders in in vitro tests and tests using patients with irritable bowel syndrome, and completed the present invention. Specifically, the present inventors discovered, in in vitro tests, that the products have an effect of increasing the intestinal contraction frequency without changing the intestinal contractile force in a distal colon-specific manner. Moreover, effects of improving the defecation condition, general abdominal condition, and health-related QOL in patients with irritable bowel syndrome were also found. Furthermore, propionic acid bacteria fermentation products can be taken in large amounts. Therefore, the propionic acid bacteria fermentation products can be expected to have an effect of preventing/treating functional gastrointestinal disorders safely.

Prophylactic and/or therapeutic agent for functional gastrointestinal disorders

According to one embodiment, a semiconductor module includes: a first circuit component: a second circuit component; and a third circuit component. The first circuit component includes: an insulating first substrate; a first conductive layer; a first switching element; and a first diode. The second circuit component includes: an insulating second substrate; a second conductive layer; a second switching element; and a second diode. The second circuit component is disposed between the first circuit component and the third circuit component. The third circuit component includes: an insulating third substrate; a third conductive layer provided on the third substrate and including a third element mounting unit; a third switching element provided on the third element mounting unit; and a third diode provided on the third element mounting unit. A direction from the third switching element toward the third diode is an opposite direction to the first direction.

Semiconductor module and method for manufacturing same

According to one embodiment, a semiconductor device includes, a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on the other side, an electrically conductive frame provided on a side periphery of the chip, a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip, and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip.

Semiconductor device and method of manufacturing the same

According to one embodiment, a semiconductor apparatus includes a semiconductor device, a heat spreader, a regulating unit, a containing unit, and a holding unit. The heat spreader is bonded to the semiconductor device with an interposed solder layer. The regulating unit is configured to regulate a dimension between the semiconductor device and the heat spreader. The containing unit is configured to contain melted solder in an interior of the containing unit. The holding unit is configured to allow melted solder held in an interior of the holding unit. The holding unit is configured to replenish the melted solder in the case where an amount of the melted solder contained in the containing unit is insufficient. The holding unit is configured to recover the melted solder in the case where the amount of the melted solder contained in the containing unit is excessive.

Semiconductor apparatus and method for manufacturing the same

The invention provides a peptide having an activity of inhibiting angiotensin-converting enzyme (ACE), and a food and drink and/or a pharmaceutical composition containing the peptide.

Peptide inhibiting angiotensin converting enzyme

According to one embodiment, a manufacturing method of a semiconductor device attained as follows. A dielectric layer having a first opening and a second opening reaching an electrode terminal is formed by modifying a photosensitive resin film on a substrate on which the electrode terminal of a first conductive layer is provided. Next, a second conductive layer that is electrically connected to the electrode terminal is formed on the dielectric layer that includes inside of the first opening, and a third conductive layer that has an oxidation-reduction potential of which difference from the oxidation-reduction potential of the first conductive layer is smaller than a difference of the oxidation-reduction potential between the first conductive layer and the second conductive layer is formed on the second conductive layer. Next, a dielectric layer having a third opening reaching the third conductive layer and a fourth opening reaching the electrode terminal via the second opening is formed by modifying a photosensitive resin film, and a bump that is electrically connected to the third conductive layer is formed.

Manufacturing method of semiconductor device and semiconductor device

The present invention relates to a preventive and/or a therapeutic agent for inflammatory bowel diseases containing a fermentation product of a propionic acid bacterium as an active ingredient.

Preventive and/or therapeutic agent for inflammatory bowel diseases

Preventive and/or remedy for inflammatory bowel diseases

For a suppressed breakage after a flip chip connection of a semiconductor device using a low-permittivity insulation film and a lead-free solder together, with an enhanced production yield, bump electrodes () are heated by a temperature profile having, after a heating up to a melting point of the bump electrodes () or more, a cooling in which a temperature within a range of 190 to 210&#xb0; C. is kept for an interval of time within a range of 3 to 15 minutes, and a condition is met, such that 1.4&#x3c;L/L&#x3c;1.6, where Lis a diameter of second electrode pads (), and Lis a diameter of first electrode pads ().

Semiconductor device and fabrication method thereof

Growing community of inventors

Yokohama, Japan

Masayuki Uchida