Toray Industries, Inc.

Other

Brother Kogyo Kabushiki-Kaisha

Masayuki Tanaka

Yasushi Sawamura

Atsuto Tokunaga

Toshimi Kawahara

Yukio Takigawa

Ken Shimizu

Yasuaki Tsutsumi

Yumiko Tsurumi

Keiji Kayaba

Toshihiro Teshiba

Naoya Okazaki

Shiro Honda

Akihiko Kishimoto

Katsuharu Morioka

Tetsuya Mieda

Katsuhiro Niwa

Hiroo Shimizu

A liquid jetting apparatus includes: a head unit which includes a liquid jetting head which jets liquid and a liquid storage tank in which the liquid to be supplied to the liquid jetting head is stored; a guide member which extends in a first direction; a carriage which has a connection portion, carries the head unit, and is supported by the guide member to be movable in the first direction; and a movement mechanism which is connected to the connection portion of the carriage to move the carriage in the first direction, and the liquid jetting head and the liquid storage tank are arranged to sandwich the connection portion of the carriage therebetween.

Liquid jetting apparatus

Resin composition for sealing semiconductor devices, which contains a filler (A) of spherical fused silica having maximum particle size of not larger than 45 &mgr;m and may contain metal impurities having a particle size of not larger than 53 &mgr;m; and a semiconductor device sealed with the resin composition.

Semiconductor-sealing resin composition and semiconductor device using it

An epoxy resin composition to seal semiconductors constructed of a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite to the base, said epoxy resin composition comprising (A) epoxy resin, (B) hardener, and (C) inorganic filler, and giving a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23&deg; C. and (b) a coefficient of linear expansion of 4&times;10 /K to 10&times;10 /K in the temperature range from 23&deg; C. to the glass transition point, with the product of (a) and (b) being smaller than 2&times;10 GPa/K.

Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device

An epoxy resin comprising (A) an epoxy resin, (B) a curing agent and (C) a filler, in which the epoxy resin (A) contains a bisphenol F-type epoxy compound (a), the filler (C) contains spherical silica and the filler (C) accounts for from 88 to 96% by weight of the resin composition, has good soldering heat resistance enough for high-temperature solder reflow and has good moldability. A semiconductor device encapsulated with the resin composition is useful for use in electronic appliances.

Epoxy resin composition and semiconductor device

A sealed semiconductor chip having a surface film of a sealed resin composition, wherein the resin composition has a linear expansion coefficient of 60&times;10 /K or less at a temperature equal to or less than its glass transition point and 140&times;10 /K or less at a temperature equal to or higher than its glass transition point; a semiconductor-sealing resin composition for sealing a semiconductor chip, which has a linear expansion coefficient of 60&times;10 /K or less at a temperature equal to or less than its glass transition point and 140&times;10 /K or less at a temperature equal to or higher than its glass transition point; the sealed semiconductor chip is chip size and has high reliability; the semiconductor-sealing resin composition creates a good seal on chip wafers and has high reliability; and the chip wafers sealed with a surface film of the resin composition warp little.

Semiconductor device and method for fabricating it, and semiconductor sealing resin composition

An epoxy resin composition to seal semiconductors constructed of a semiconductor element, a base to support said semiconductor element, and an epoxy resin composition covering only one side opposite to the base, said epoxy resin composition comprising (A) epoxy resin, (B) hardener, and (C) inorganic filler, and giving a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23&deg; C. and (b) a coefficient of linear expansion of 4&times;10,/K to 10&times;10,/K in the temperature range from 23&deg; C. to the glass transition point, with the product of (a) and (b) being smaller than 2&times;10,GPa/K.

Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

Semiconductor element sealed with an epoxy resin compound

Epoxy resin composition

Epoxy resin compound

A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.

Semiconductor device-encapsulating epoxy resin composition

Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.

Semiconductor device-encapsulating epoxy resin composition containing

Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.

An antistatic resinours composition comprising (A) graft copolymers prepared by emulsion polymerization of (a) monomer mixture consisting of (i) from 50 to 100 percents by weight of monomers having polyalkylene oxide chains and (ii) from 50 to 0 percents by weight of vinyl monomers in the presence of rubbers and (B) thermoplastic resins compatible with the graft copolymers, has permanent antistatic performances, superior mechanical properties and high flowability.

Growing community of inventors

Nagoya, Japan

Masayuki Tanaka