Hitachi, Ltd.

Echo Co. Ltd.

Elpida Memory, Inc.

Masayuki Takahashi

Iwao Takemoto

Akiya Izumi

Atsumu Iguchi

Hiroichi Sokei

Kunio Niwa

Masahiko Kadowaki

Hiroyoshi Kojima

Masaaki Yokoyama

Junichirou Nakajima

Takamasa Naito

Wen Zheng Li

Tadanobu Toba

Shuji Kikuchi

Katsunori Hirano

Yuji Sonoda

Junichiro Nakajima

Takashi Kanesaka

Masahiko Kodowaki

Semiconductor testing equipment according to the present invention comprises: an algorithmic pattern generator for generating a test pattern for testing a memory under test and applying the pattern to the memory under test; a comparator for comparing a response signal from the memory under test and an expected value from tho algorithmic pattern generator; a fail address acquisition part for storing an address of the memory under test (fail address) when a result compared by the comparator is failed; a fail address analysis part for analyzing the failed address and calculating the address to be repaired (repair address); and a cycle-pattern generator for redundancy processing for inserting the address to be repaired into a test pattern and applying the address to the memory under test, so that even when capacity of the semiconductor memory is increased, a fabrication yield thereof is raised by testing the memory after the packaging and by performing the redundancy processing of a defective.

Semiconductor testing equipment, testing method for semiconductor, fabrication method of semiconductor, and semiconductor memory

A video camera unit is separated into a holder for receiving lenses and a base on which a solid-state image pickup chip is mounted. The holder and the base are assembled together with the distance between them made variable so that it is possible to adjust the back focus of the lens. Further, a video camera unit has a holder which is separated into a first holder for receiving lenses and a second holder for receiving a solid-state image pickup device so that both holders can be assembled together with the distance between them made variable. Therefore, it is also possible to adjust the back focus of the lens.

Semiconductor device and video camera unit having the same and method

Video camera unit having an airtight mounting arrangement for an image

An imaging assembly, which is particularly useful for a video camera unit, comprising a set of lenses, some of which have a non-refractive surface, and an image sensor. A holder is provided for holding both the set of lenses and the image sensor to be aligned with one another. Circuitry is also provided so that the sensitivity of the image sensor can be electrically varied.

Semiconductor device and video camera unit using it and their

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Fujisawa, Japan

Masayuki Takahashi