Toyota Jidosha Kabushiki Kaisha

Other

Mec International Corporation

Masayuki Sumiyoshi

Fumio Kawahara

Koichi Sugiura

Koji Mizuno

Naoki Abe

Heijiro Ojima

Kojiro Murayama

Katsuya Murakami

Mitsuru Tomono

Eiji Nakamura

Kazunori Kagawa

Akihiro Otomo

Tsuyoshi Yano

Yoshiaki Kominami

Mitsuru Tomoto

Hiroyuki Miwa

Tatsuya Mizobe

A power source monitoring apparatus for monitoring a state of a subject power source which consists of at least one of a plurality of electric power sources in an electric system wherein a load device having at least one electrically operated load is electrically connected to the power sources, the monitoring device apparatus a detecting portion which detects a voltage and/or a current of at least one of the load device and the plurality of electric power sources, and a diagnosing device which diagnoses the subject power source for an abnormality on the basis of an output of the detecting portion, while the electric system is placed in a power supply state wherein an electric power is permitted to be supplied from only the subject power source to the load device.

Apparatus for diagnosing electric power source while power is supplied to load device from the power source

A process and an apparatus for forming a gasket directly on a workpiece having a joining surface which has an annular gasket-fixing groove, wherein a mold having a gasket-forming groove which cooperates with the gasket-fixing groove to define a cavity for forming the gasket is clamped to the joining surface of the workpiece, and a material is injected into the cavity through an injection passage which is formed through the mold and which communicates with the gasket-forming groove. The material is cured into the gasket, and the mold is removed from the workpiece. The mold may have two elastic sealing members disposed on inner and outer sides of the gasket-forming groove, respectively, so as to extend along the gasket-forming groove, and provide pressure-tight sealing of the cavity when the body is placed on the workpiece such that the sealing members are held in elastic pressure-tight contact with the joining surface.

Process of forming a gasket directly on workpiece, using a mold clamped

Disclosed herein is a technique of removing metal contained in a solution through chelation, which makes it possible to preclude undesired aggregation and permit effective aggregation through an aggregating process. A surface active agent containing a hydrophobic group, a hydrophilic group and a chelating group is added to the solution to be processed, and subsequently an aggregating process is carried out. The chelating group chelates metal, the hydrophilic group prevents undesired aggregation, and the hydrophobic group is effectively aggregated in the aggregating process. Various uses are possible by selecting the charge of ligand.

Method for removing metal contained in solution using surfactant having

An apparatus for removing metal contained in a solution through chelation which includes a means for adding a surface active agent containing a hydrophobic group, a hydrophilic group and a chelating group to a metal containing solution held within a metal solution accommodating means. An electric field applying means is adapted to apply an electric field to the solution containing means and further means is provided for separating an aggregate from the metal contained solution.

Method of and apparatus for removing metal contained in solution and

Method of removing metal contained in solution

Growing community of inventors

Okazaki, Japan

Masayuki Sumiyoshi