Asahi Kogaku Kogyo Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Pentax Corporation

Asahi Kogaku Kogyo K.k.

Masayuki Sugiura

Masato Hara

Toshihiro Nakayama

Atsushi Kida

Yasuhiko Kuriyama

Toru Sugiyama

Yoshikazu Tanabe

Kiyoshi Yamamoto

Kouhei Morizuka

Taichi Nakanishi

Yoichiro Kurita

Takanobu Kamakura

Yoshiaki Aizawa

Makoto Shibamiya

Toshiyuki Shimizu

Minoru Amano

Toshiki Seshita

Yukie Nishikawa

Takao Noda

Masato Maeda

Yoshitomo Sagae

Yoshio Itagaki

Hirotsugu Wakimoto

Yasuo Ashizawa

Masanori Ochi

Chiharu Nozaki

Noriyasu Kurihara

Takashi Tohara

Aki Sasaki

An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.

Electronic device

A semiconductor device includes a gate electrode, source regions and drain regions, a body contact region, and a body bias control electrode. The gate electrode includes a plurality of first portions arranged in parallel with a first distance therebetween, and a second portion connecting the plurality of first portions. The source regions and the drain regions are provided between the plurality of first portions. The body contact region is disposed on the other side of the source regions and the drain regions relative to the second portion. The body bias control electrode is provided on the body contact region in parallel with the second portion at a second distance from the second portion that is greater than the first distance, and is electrically connected to the body contact region.

Semiconductor device

A switch circuit, a control circuit, a grounding wire and a control wire are formed on a substrate. The switch circuit connects an antenna terminal with one of multiple high frequency terminals. The control circuit outputs a control signal to the switch circuit. The grounding wire is disposed between the switch circuit and the control circuit and extends from a location proximate to an edge of the substrate to a location proximate to an opposite edge of the substrate. The control wire that carries the control signal is disposed between one end of the grounding wire and an edge of the semiconductor substrate.

High frequency semiconductor switch

According to one embodiment, a high-frequency switch includes a high-frequency switch IC chip. The high-frequency switch IC chip has a high-frequency switching circuit section including an input terminal, a plurality of switching elements, a plurality of high-frequency signal lines, and a plurality of output terminals. The input terminal is connected to each of the plurality of output terminals via each of the plurality of switching elements with the high-frequency signal lines having the same lengths. The plurality of output terminals are arranged on a surface at an outer periphery of the high-frequency switch IC chip. The input terminal is arranged on the surface of the high-frequency switch IC chip at the center of the high-frequency switch IC circuit section.

High-frequency switch

According to one embodiment, a capacitor includes a substrate, a first electrode, a second electrode, and a first dielectric portion. The substrate includes an insulating layer and a semiconductor layer provided on the insulating layer. The semiconductor layer includes a dummy active region electrically isolated from an active region including an active element. The first electrode and the second electrode are located to oppose each other above the dummy active region. The first dielectric portion is provided between the first electrode and the second electrode.

Capacitor, integrated device, radio frequency switching device, and electronic apparatus

A semiconductor device, which is connected to a protected device and protects a protected device, includes a semiconductor layer provided on an insulating film; a plurality of source layers which is formed in the semiconductor layer and extends in a first direction; a plurality of drain layers which is formed in the semiconductor layer and extends along with the source layers; a plurality of body regions which is provided between the source layers and the drain layers in the semiconductor layer and extends in the first direction; and at least one body connecting part connecting the plurality of body regions, wherein a first width between the source layer and the drain layer at a first position is larger than a second width between the source layer and the drain layer at a second position, the second position is closer to the body connecting part than the first position.

A power amplifier including an active device having at least one heterjunction bipolar transistor based on a compound semiconductor; a diode connected between the base and the emitter of the bipolar transistor in reverse direction with respect to the base-emitter diode; a resistor connected in series between one electrode of the diode and the base of the bipolar transistor; and a bias circuit connected between the diode and the resistor, wherein the bipolar transistor includes a plurality of transistors, and each transistor is connected to the bias circuit via a resistor connected to a base of the transistor. The bias circuit may include an emitter follower circuit having a bipolar transistor.

Power amplifier

A semiconductor apparatus includes a semiconductor substrate having a device region and a periphery region surrounding the device region; a semiconductor device provided in the device region of the semiconductor substrate; a first electrode pad provided on the semiconductor substrate; a second electrode pad provided on the semiconductor substrate; a strip-like, first conductivity type semiconductor pattern; and a strip-like, second conductivity type semiconductor pattern. The strip-like, first conductivity type semiconductor pattern extends in the periphery region of the semiconductor substrate, and the first electrode pad is electrically connected to one end of the first conductivity type semiconductor pattern. The strip-like, second conductivity type semiconductor pattern constitutes a p-n junction in conjunction with the first conductivity type semiconductor pattern. The first and second electrode pads are electrically connected to both ends of the second conductivity type semiconductor pattern.

Semiconductor apparatus and method of manufacturing same, and method of detecting defects in semiconductor apparatus

A ground layer is provided between a first and a second wiring layer. A first transistor provided at the first wiring layer amplifies a supplied high-frequency signal. A second transistor provided at the first wiring layer amplifies the output signal of the first transistor. A first power supply line, which supplies power to the first transistor, is provided at the first wiring layer. A second power supply line, which supplies power to the second transistor, is provided at the second wiring layer.

High-frequency power amplifier module

A high-frequency amplification device includes a high-frequency amplifier including input and output sections, a first capacitor including first and second electrodes, and a first insulation film interposed therebetween. The first electrode is connected to the output section via a first inductor, and the second electrode is grounded. The amplification device further comprises a second capacitor including third and fourth electrodes and a second insulation film interposed therebetween. The third electrode is formed of a material substantially identical to that of the first electrode, and the fourth electrode is formed of a material substantially identical to that of the second electrode. The second insulation film is formed of a material substantially identical to that of the first insulation film and has a thickness substantially identical to that of the first insulation film.

High-frequency amplification device

A high frequency semiconductor module, includes: a semiconductor chip having top and bottom surfaces; a semiconductor element merged in the semiconductor chip; a ground pad of the semiconductor element disposed on the top surface; a metal layer configured to connect to the ground pad and extend to sidewalls of the semiconductor chip; a ground metal arranged on a surface of a mounting substrate; and a conductive material formed on the ground, configured to connect the metal layer and the ground metal.

High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same

An optical member inspection apparatus includes an inspection optical system having a light source, and a diffusing means for diffusing the light emitted from the light source. The diffusing means has a central portion and a peripheral portion. The diffusion transmittance of the peripheral portion is higher than the diffusion transmittance of the central portion. The inspection optical system is also provided with an image pick-up means to pick-up an image of the optical member to be inspected, and is positioned so as to receive that light emitted from the light source and transmitted through the diffusing means and the optical member. A judging means is also provided, for judging whether or not the optical member has a defect, in accordance with image signals output from the image pick-up means.

Growing community of inventors

Tokyo, Japan

Masayuki Sugiura