Hitachi Aic Inc.

The Furukawa Electric Co., Ltd.

Masayuki Sakurai

Ryouji Sugiura

Kazumitsu Ishikawa

Hiroyuki Kudoh

Kenichi Masuda

Hayao Ishitani

Satoshi Isoda

Takanori Nishida

Yasuo Morita

Yasuaki Nakamura

For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes. . . within an inside of an insulating substrate, has a base substrateand a reflector substrate, which is laminated and adhered on an upper surface thereof. In the base substrateis formed a though hole, on the reverse surface of which is formed a heat radiating platemade from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film, and further wiring patterns. . . are formed on the substrate. On the other hand, the reflector substrateis formed with a through hole, having a diameter larger than that of the through hole of the base substrate, and on an inner peripheral surface thereof is formed a reflection film. This reflector substrate is disposed and adhered on an upper surface of the base substrate, at such the position that portions of the wiring patterns are exposed through the through hole thereof, and the plural number of the light emitting diodes are connected to the wiring patterns on the base substrate, to be mounted thereon.

Chip-type light emitting device and wiring substrate for the same

An electronic device is provided which includes a substrate of insulating resin having at least a pair of interior terminal portions on an upper surface thereof, an electronic element mounted on the terminal portions, having at least a pair of electrode terminals thereof, and a member of insulating resin, bonded on the upper surface of said substrate. The frame includes a cavity to store the electronic element. A cover member of insulating material hermetically seals over the cavity. Electrodes are formed at or in vicinity of positions of the terminals of said electronic element to electrically conduct the interior terminal portions for connection outside the device. Alternatively, roughened surfaces can be formed on metal electrode portions, which are formed on the upper surface of substrate for electrically conducting said interior terminal portions to exterior terminal portions.

Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device

An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of a board and extending from an upper surface to a lower surface. The filler fills the groove and has a plating catalytic function. The plating conductor covers an exposed surface of the filler. A method of manufacturing the electronic component device is also disclosed.

Electronic component device and method of manufacturing the same

A printed wiring board ( ) having a cavity ( ) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate ( A) having flat surfaces on both sides; a lower plate body ( B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity ( ) in a part thereof, for receiving an electronic part ( ) within an inside thereof; conductor layers ( ) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes ( ) or flat through-holes ( &prime;), in particular with in a region of the cavity on the reverse side surface thereof; and external electrodes ( ) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc., can be received or stored within a space of the cavity ( ), thereby enabling the mounting of the electronic parts thereon with high density and reliability, such as on a motherboard ( ).

Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof

An electrical junction block for an automobile which can be used in an atmosphere at temperatures equal to or higher than 70.degree. C. and in which metal bus bars formed in preset circuit patterns are used as a wiring connection inside a case body. The case body of the electrical junction block is molded by using a nylon polymer alloy. A method for manufacturing an electrical junction block for automobiles. The electrical junction block having upper and lower case bodies which are engaged with each other. The upper and lower case bodies are molded by using a nylon polymer alloy, and functional parts are mounted without incurring a moisture absorbing process.

Growing community of inventors

Tokyo, Japan

Masayuki Sakurai