Mitsubishi Electric Corporation

Masayuki Saiki

Koji Funaoka

Takashi Inoue

Tatsuya Yamamoto

Takayuki Hirano

Yoshiharu Kurosaki

Yuzuru Tadokoro

Hiroaki Ashizawa

Hiromasa Mihara

A laser apparatus includes a laser oscillator; an acousto-optic modulation unit including a first acousto-optic modulator that diffracts a laser beam from the laser oscillator when a first ultrasonic wave is applied and a second acousto-optic modulator that diffracts a higher order beam output from the first acousto-optic modulator when a second ultrasonic wave is applied; and an amplifier that amplifies the laser beam from the acousto-optic modulation unit, a propagation direction of the first ultrasonic wave relative to a diffracted direction of the higher order beam emitted from the first acousto-optic modulator and a propagation direction of the second ultrasonic wave relative to a diffracted direction of a higher order beam emitted from the second acousto-optic modulator being different.

Laser apparatus and laser machining apparatus

A laser processing method for laser processing of a workpiece made of a base material and a fiber reinforced composite material containing fibers having a thermal conductivity and a processing threshold higher than physical properties of glass fibers. The laser processing method includes a step of processing the workpiece by forming a plurality of through-holes extending through the workpiece by irradiating the workpiece with pulsed laser light from a processing head while relatively moving the workpiece and the processing head in a predetermined cutting direction. The pulsed laser light has a pulse width smaller than 1 ms and an energy density capable of forming each of the through-holes by a single pulse.

Laser processing method and laser processing apparatus

A laser machining apparatus that separates a workpiece into a machined product and a remnant material by cutting using irradiation with a laser beam includes: a nozzle that squirts gas at a machining point; a rotation mechanism that causes the nozzle or the workpiece to rotate about an optical axis; and a controller that performs control of the rotation mechanism. This control causes the nozzle, which squirts the gas at the machining point, to be at the machined product side during the cutting.

Laser machining apparatus and laser machining method

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Tokyo, Japan

Masayuki Saiki