Screen Holdings Co., Ltd.

Dainippon Screen Mfg. Co., Ltd.

Masayuki Otsuji

Hiroaki Takahashi

Yuta Sasaki

Manabu Okutani

Masahiko Kato

Yu Yamaguchi

Masahiro Kimura

Tetsuya Emoto

Naozumi Fujiwara

Tomonori Kojimaru

Shota Iwahata

Hiroshi Abe

Chikara Maeda

Shuichi Yasuda

Ayumi Higuchi

Yukifumi Yoshida

Hitoshi Nakai

Masaki Inaba

Yasunori Kanematsu

Eri Fujita

Yoshiyuki Fujitani

Daisuke Shimizu

A sublimable substance is selected on the basis of whether the surface of a pattern is hydrophilic or hydrophobic. In cases where the surface of a pattern is hydrophilic, a solvent for hydrophilic cases is selected, said solvent having lower solubility in water than the selected sublimable substance; and in cases where the surface of a pattern is hydrophobic, a solvent for hydrophobic cases is selected, said solvent having lower solubility in oils than the selected sublimable substance. The selected sublimable substance is dissolved in the selected solvent.

Method for producing liquid containing sublimable substance, substrate drying method, and substrate processing apparatus

The collapsed pattern recovering method is a method for recovering a collapsed pattern which is a pattern formed on a front surface of a substrate, and the method includes a reactive gas supplying step which supplies to the front surface of the substrate a reactive gas that can react with a product existing on the front surface. The reactive gas supplying step includes a hydrogen fluoride vapor supplying step which supplies vapor that contains hydrogen fluoride to the front surface of the substrate. The collapsed pattern recovering method further includes a substrate heating step which heats the substrate in parallel with the hydrogen fluoride vapor supplying step.

Method of restoring collapsed pattern, substrate processing method, and substrate processing device

A pre-drying processing liquid containing a sublimable substance that changes to gas without passing through to a liquid and a solvent in which the sublimable substance dissolves is supplied to a front surface of a substrate on which a pattern has been formed. Thereafter, the solvent is evaporated from the pre-drying processing liquid on the front surface of the substrate to thereby form a solidified body containing the sublimable substance on the front surface of the substrate. Thereafter, the solidified body is sublimated and thereby removed from the front surface of the substrate. A value acquired by multiplying a ratio of the thickness of the solidified body to the height of the pattern by 100 is greater than 76 and less than 219.

Substrate processing method, substrate processing apparatus and pre-drying processing liquid

To dry a substrate formed with a pattern on a front surface satisfactorily and with excellent drying performance, a substrate processing method comprises: a liquid film formation step of forming a liquid film of a processing liquid, in which cyclohexanone oxime is dissolved in a solvent, on a front surface of a substrate formed with a pattern by supplying the processing liquid to the front surface of the substrate; a solidified film formation step of forming a solidified film of the cyclohexanone oxime by solidifying the liquid film of the processing liquid; and a sublimation step of removing the solidified film from the front surface of the substrate by sublimating the solidified film.

Substrate processing method and substrate processing apparatus

A substrate processing apparatus includes a substrate holding unit that holds a substrate horizontally while rotating the substrate around a vertical rotational axis running through its center portion, an opposed member having an opposed surface that is opposed to an upper surface of the substrate, and a processing liquid discharge unit that includes a center portion discharge port on the opposed surface, that opens being opposed to the upper surface center portion of the substrate, and a peripheral portion discharge port on the opposed surface, that opens being opposed to the upper surface peripheral portion of the substrate, that discharges a processing liquid from the center portion discharge port to supply the processing liquid between the substrate and the opposed surface, and discharges the processing liquid from the peripheral portion discharge port to replenish the processing liquid between the substrate and the opposed surface.

Substrate processing apparatus and substrate processing method

An upper surface of a substrate is supplied with a pre-drying processing liquid which is a solution of a sublimable substance and a solvent. Thereafter, the solvent is evaporated from the pre-drying processing liquid on the substrate and a solid of the sublimable substance is precipitated in the pre-drying processing liquid on the substrate. Thereafter, at least a portion of the solid of the sublimable substance is dissolved in the pre-drying processing liquid on the substrate. Thereafter, the solvent is evaporated from the pre-drying processing liquid in which the solid of the sublimable substance has been dissolved and the solid of the sublimable substance is precipitated onto the substrate. Thereafter, the solid of the sublimable substance is sublimated and removed from the upper surface of the substrate.

Substrate drying method and substrate processing apparatus

A substrate processing method includes a processing liquid film forming step of supplying a processing liquid, containing a sublimable substance, to a pattern forming surface of a substrate, to form a processing liquid film on the pattern forming surface, a temperature maintaining step of maintaining a temperature of the processing liquid film, formed on the pattern forming surface, in a temperature range not lower than a melting point of the sublimable substance and lower than a boiling point of the sublimable substance, a film thinning step of thinning the processing liquid film while the temperature of the processing liquid film is in the temperature range, a freezing step of making the processing liquid film, thinned by the film thinning step, freeze on the pattern forming surface after the temperature maintaining step to form a frozen body of the sublimable substance, and a sublimating step of sublimating the frozen body to remove the frozen body from the pattern forming surface.

A substrate processing method including a vapor atmosphere filling step in which a vapor atmosphere which contains vapor of a low surface tension liquid whose lower surface tension than a processing liquid is filled around a liquid film of the processing liquid, a thin film region forming step in which, in parallel with the vapor atmosphere filling step, a substrate is rotated at a predetermined thin film region forming speed, to partially remove the processing liquid, thereby forming a thin film region on the liquid film of the processing liquid, a thin film region expanding step in which, in parallel with the vapor atmosphere filling step, the thin film region is expanded to an outer circumference of the substrate, and a thin film removing step in which the thin film is removed from the upper surface after the thin film region expanding step.

Substrate treatment method and substrate treatment device

A substrate processing method includes a vapor atmosphere filling step of filling surroundings of a liquid film of a processing liquid with a vapor atmosphere containing a vapor of a low surface tension liquid that has a lower surface tension than the processing liquid, a dry region forming step of forming a dry region in the liquid film of the processing liquid by partially excluding the processing liquid while spraying a gas containing the vapor of the low surface tension liquid onto the liquid film of the processing liquid in parallel with the vapor atmosphere filling step, and a dry region expanding step of expanding the dry region toward an outer periphery of a substrate while rotating the substrate in parallel with the vapor atmosphere filling step.

A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.

A substrate processing method includes a substrate holding step of horizontally holding a substrate, a liquid film forming step of supplying a processing liquid onto the upper surface of the substrate to form a liquid film of the processing liquid covering the upper surface of the substrate, a liquid film-removed region-forming step of partially eliminating the processing liquid from the liquid film of the processing liquid to form a liquid film-removed region in the liquid film of the processing liquid, a liquid film-removed region enlarging step of enlarging the liquid film-removed region toward the outer periphery of the substrate, and a hydrogen fluoride atmosphere-holding step of keeping the ambient atmosphere at the boundary between the liquid film-removed region and the liquid film of the processing liquid as an atmosphere of hydrogen fluoride-containing vapor, in parallel with the liquid film-removed region enlarging step.

In a method of forming a sacrificial film, a liquid filmof a sacrificial polymer solutionwhich covers the front surface of a substrate W in which patterns P are formed is heated from the side of the substrate, the solution in contact with the front surface of the substrate is evaporated and thus the liquid film is dried in a state where the liquid film is held on at least tip end portions other than base portions of the patterns, with the result that a sacrificial film is formed. In a substrate processing method and a substrate processing apparatus, the front surface of the substrate is processed while the collapse of the patterns is suppressed or prevented by utilization of the formed sacrificial film.

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Kyoto, Japan

Masayuki Otsuji