Hitachi Chemical Dupont Microsystems, Ltd.

Masayuki Ooe

Hajime Nakano

Takumi Ueno

Yoshiko Tsumaru

Masataka Nunomura

Yasuharu Murakami

Hiroshi Matsutani

Dai Kawasaki

Hiroshi Komatsu

Kouji Katou

Takashi Hattori

Tomonori Minegishi

Keishi Ono

Taku Konno

Masashi Kotani

A positive photosensitive resin composition including:

Positive photosensitive resin composition, method for producing patterned cured film and electronic component

A photosensitive polymer composition includes (a) a polyamide having a repeating unit represented by the following general formula (I): wherein U represents a tetravalent organic group, V represents a bivalent organic group and p is an integer representing a number of the repeating unit; (b) a compound which generates an acid upon receiving light; and (c) a compound represented by the following general formula (II): wherein m and n are each independently integer of 1 or 2, Rs are each independently hydrogen, alkyl group or acyl group, and Rand Reach independently represents fluoroalkyl group having 1 to 3 carbon atoms.

Photosensitive polymer composition, method of producing pattern and electronic parts

A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (&#x2014;NH) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.

Photosensitive polymer composition, method of forming relief patterns, and electronic equipment

Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280&#xb0; C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Positive photosensitive resin composition, method for forming pattern, and electronic part

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Ibaraki, Japan

Masayuki Ooe