Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Kawasaki Steel Corporation

Dow Toray Co., Ltd.

Toray Silicone Company Limited

Dow Corning Corporation

Dow Silicones Corporation

Kawaski Steel Corporation

Masayuki Onishi

Harumi Kodama

Hiroji Enami

Toyohiko Fujisawa

Tadashi Okawa

Tomoko Kato

Saburo Moriwaki

Koji Nakanishi

Hiroshi Fukui

Masaaki Amako

Yoshito Ushio

Osamu Mitani

Miyoji Fukayama

Hidekatsu Hatanaka

Shigeru Ogura

Haruhiko Furukawa

Makoto Yoshitake

Takuya Ogawa

Yan Huang

Lei Huang

Tomoaki Kimura

Peter Cheshire Hupfield

Lei Fang

Yuji Miki

Kazumi Nakayoshi

Toshiki Nakata

Yuki Nabeshima

Akiko Takanami

Nagayasu Bessho

Toshikazu Sakuraya

Hideo Kuguminato

Hirosuke Yamada

Satoshi Onodera

Kent R Larson

Keiji Wakita

Kouichi Ozaki

Manabu Sutoh

Shinji Kojima

Eiji Kitaura

Takao Koshikawa

Kyoji Nakanishi

Masaru Washio

Hiroshi Nomura

Noboru Yasukawa

Hidenari Kitaoka

Kazuhisa Hamagami

Hiromitsu Yamanaka

Kenji Saito

Wataru Nishiumi

Kazuya Asano

Takayuki Kaji

Katsuhisa Hirayama

Hideshi Ohzu

Yoshiro Tomiyama

Kazuo Arai

Mototatsu Sugizawa

Shuji Tanaka

Hitoshi Ohsugi

Keiichiro Isomura

Qi Chen

Hong Sub Kim

Toshio Kato

Mitsuru Sakurai

Minoru Yao

Akiko Nabeta

Kanji Emoto

Masakatsu Ogawa

Akihiko Nanba

Masaru Shibata

Guijun Yang

Yasuo Masuda

Yozo Tanino

Tsukasa Terashima

Michio Ibaraki

Masaki Takashi

Takeshi Higashihara

Hitoshi Osugi

Ryo Sakaguchi

A curable organopolysiloxane composition is provided. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organosiloxane having one silicon atom-bonded hydrogen atom per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (C) an organosiloxane having one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded alkoxy group per molecule and free of alkenyl groups; (D) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (E) a hydrosilylation reaction catalyst; and (F) a condensation reaction catalyst. The curable organopolysiloxane composition can be cured to form a cured product. The cured product generally exhibits an excellent adhesion property against various substrates without cracking and delamination occurring after a thermal shock test.

Curable organopolysiloxane composition, cured product, and electric/electronic equipment

Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.

Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts

A single-fluid curable thermally conductive silicone grease composition having long-term storage stability at room temperature is provided. The single-fluid curable thermally conductive silicone grease comprises: an organopolysiloxane, having an aliphatic unsaturated hydrocarbon group per single molecule, with a viscosity at 25&#xb0; C. between 50 and 100,000 mPa&#xb7;s; an organohydrogen siloxane that includes hydrogen atoms bonded to at least two silicon atoms per single molecule; a thermally conductive filler that includes particle diameters with an average particle diameter between 0.01 and 200 &#x3bc;m; a microparticle catalyst, with an average particle diameter of between 0.01 and 10 &#x3bc;m, comprising a thermoplastic resin with a softening point between 40&#xb0; C. and 200&#xb0; C., wherein a platinum-based catalyst is included at no less than 0.01 mass %, as platinum metal atoms; and a curing control agent. The complex modulus of elasticity after curing of the composition is between 0.01 MPa and 20 MPa at 25&#xb0; C.

Thermally conductive silicone compound

A room temperature curable organopolysiloxane composition for protecting electric/electronic parts is disclosed. The composition comprises: (A) an organopolysiloxane having a viscosity at 25&#xb0; C. of 20 to 1,000,000 mPa&#xb7;s and having at least two silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups in a molecule; (B) an alkoxysilane represented by the following general formula or a partial hydrolysis condensation product thereof: RSi(OR)wherein Ris a monovalent hydrocarbon group having a carbon number of 1 to 12, Ris an alkyl group having a carbon number of 1 to 3, and subscript 'a' is an integer of 0 to 2; (C) a mercaptobenzothiazole based compound; (D) zinc oxide powder and/or zinc carbonate powder; and (E) a catalyst for condensation reactions. The composition and/or a cured product thereof can protect electric/electronic parts from corrosive gases such as hydrogen sulfide gas and sulfuric acid contained in the atmosphere.

Room temperature curable organopolysiloxane composition for protecting electric/electronic parts

Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.

Thermally conductive silicone composition and electrical/electronic apparatus

A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.

Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components

A room-temperature-curable silicone rubber composition exhibiting good adhesion to a substrate contacted during curing and capable of suppressing the occurrence of oil bleeding is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) a mixture of (A1) an organopolysiloxane having at least two specified alkoxysilyl-containing groups in the molecular and (A2) an organopolysiloxane having one specified alkoxysilyl-containing group in the molecular; (B) an organopolysiloxane lacking a hydroxyl group and an alkoxy group; (C) an alkoxysilane; and (D) a condensation-reaction catalyst.

Room-temperature-curable silicone rubber composition, and the use thereof

A room-temperature-curable silicone rubber composition which exhibits good adhesion to a substrate contacted during curing and which forms a silicone rubber cured product that can be efficiently peeled is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having in each molecule at least two specified alkoxysilyl-containing groups on silicon atoms in the molecular chain, (B) a diorganodialkoxysilane or partially hydrolyzed condensate thereof, and (C) a condensation-reaction catalyst.

Room-temperature-curable silicone rubber composition, the use thereof, and method for repairing electronic device

The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.

Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers

A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a reinforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.

Room-temperature-curable silicone rubber composition

A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25&#xb0; C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.

Room-temperature curable organopolysiloxane composition

Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (RSiO)(SiO)in which Ris substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

Adhesive silicone elastomer sheet

A room-temperature-curable organopolysiloxane composition comprising:

Room-temperature-curable organopolysiloxane composition

A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

Heat-conductive silicone composition

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Chiba, Japan

Masayuki Onishi