Matsushita Electric Industrial Co., Ltd.

Minolta Company, Ltd.

Masayuki Okano

Satoru Fujii

Hideo Torii

Yoshihiro Tomita

Ryoichi Takayama

Atsushi Komatsu

Seiichi Nakatani

Masahide Tsukamoto

Osamu Kawasaki

Akihiko Namba

Tamao Kojima

Hideo Hatanaka

Masayuki Sakai

Yosihiro Tomita

Eiji Fujii

Kazuhiro Nishikawa

Norihito Tsukahara

Atsushi Tomozawa

Katsumi Imada

Yusuke Adachi

Toru Ninomiya

It comprises circuit boardwith circuit patternformed by conductive resin paste on resin substrate, surface-mounted type electronic componentsarranged with electrode terminals with respect to the connecting region of circuit pattern, connecting memberformed from conductive resin paste for connecting the connecting region to the electrode terminal, and insulating adhesivefor bonding the electronic componentsand circuit board, which is lower in curing temperature than conductive resin paste and disposed in a space between circuit boardand electronic componentsbetween connecting regions.

Electronic circuit device and its manufacturing method

A miniature pump includes a miniature pump portion including a suction passage through which a liquid flows in, and a discharge passage through which the liquid flows out, and a bubble trap portion for blocking an entry of air bubbles into the miniature pump portion. Since the bubble trap portion prevents the entry of air bubbles into the miniature pump portion, a deterioration of pump characteristics owing to the entry of air bubbles can be suppressed, making it possible to obtain a miniature pump that achieves both a large discharge flow rate and stable discharge flow rate characteristics.

Miniature pump, cooling system and portable equipment

A variable dot ink-jet printer having an ejection flow passage with a decrease in sectional area from an ejection port toward the interior of the flow passage and up to a boundary. A draw-in part draws an ink front position in the interior of the flow passage. A push-out part pushes out the ink front position outside the flow passage. When ejecting a small ink drop, the ink front position is drawn at a place having an increase in sectional area by the draw-in part. The ink is pushed outward by the push-out part at such a speed as to exit from an edge of an area of the boundary on the ejection port side.

Variable dot ink-jet printer

A liquid injection device has a liquid pressurizing chamber having one or a plurality of apertures, a liquid injection port provided at a part of the liquid pressurizing chamber, a liquid pressurizing member arranged adjacent to the liquid pressurizing chamber, a liquid passage arranged adjacent to the liquid pressurizing chamber; wherein within the aperture(s), a peripheral edge portion of the aperture(s) located at a position opposite to the liquid pressurizing member and the liquid pressurizing member are arranged to be apart from each other at a gap with a predetermined size; further wherein liquid is injected through the liquid injection port by driving the liquid pressurizing member to thereby pressurize the liquid supplied from the liquid passage into the liquid pressurizing chamber.

Liquid injection device, manufacturing method therefor, liquid injection method and manufacturing method for piezo-electric actuator

A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

Nonwoven fabric cloth substrate for printed wiring boards, and prepreg

A first ferroelectric thin film device is provided with a first substrate consisting of polycrystal, amorphous material or metal material and a first ferroelectric thin film formed on the first substrate. The average of thermal expansion coefficients of the substrate from room temperature to temperature for forming the ferroelectric thin film is 70.times.10.sup.-7 /.degree.C. or more. At least 75% of crystal axes of the first ferroelectric thin film are oriented in &lt;001&gt;-direction. A second ferroelectric thin film device is provided with a second substrate consisting of amorphous material and a second ferroelectric thin film formed on the second substrate. The average of thermal expansion coefficients of the substrate from room temperature to temperature for forming the ferroelectric thin film is 50.times.10.sup.-7 /.degree.C. or less. At least 75% of crystal axes of the second ferroelectric thin film are oriented in &lt;100&gt;direction.

Ferroelectric thin film device and its process

A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

A pyroelectric infrared detector includes a substrate having a recess. A pyroelectric portion substantially aligns with the recess. A resin film is located between the substrate and the pyroelectric portion. The recess faces the resin film. First and second electrodes are connected to first and second surfaces of the pyroelectric portion respectively. The pyroelectric portion may include a pyroelectric film of Pb.sub.x La.sub.y Ti.sub.z Zr.sub.w O.sub.3 where atomic fractions 'w', 'x', 'y', and 'z' satisfy one of following conditions a), b), and c):

Growing community of inventors

Kawanishi, Japan

Masayuki Okano