Toppan Printing Co., Ltd.

Masayuki Ode

Takehito Tsukamoto

Takao Minato

Masataka Maehara

Hiroshi Matsuzawa

Koichi Kumai

Satoshi Akimoto

Daisuke Inokuchi

Shigeru Hirayama

Yuichi Sakaki

Kenta Yotsui

Takumi Suemoto

A method of manufacturing a multi-layer circuit wiring board, including simultaneously laminating a second flexible resin film on one surface of a first flexible resin film having a first wiring pattern on at least one surface thereof, and a third wiring pattern on another surface of the first flexible resin film, the second flexible resin film having a second wiring pattern formed on at least one surface thereof, and the third flexible resin film having a third wiring pattern formed on at least one surface thereof.

Method of manufacturing multi-layer wiring board

An optical-electric printed wiring board includes an electric wiring substrate having electric interconnects, and an optical wiring layer stacked on the electric wiring substrate and having a surface on which an optical part is mounted. The optical wiring layer includes a core for propagating light, a clad for sandwiching the core, and a mirror for reflecting light propagating in the core toward an optical part mounted on the optical wiring layer, or reflecting light from an optical part into the core. The electric wiring substrate includes conductive setting portions each of which extends through the optical wiring layer in the direction of stacking and has an end face on which an optical part is set. These conductive setting portions obtain electrical conduction between the optical part and the electric interconnects.

Optical-electric printed wiring board, printed circuit board, and method of fabricating optical-electric printed wiring board

A first clad layer is formed on a smooth support substrate via a release layer. On the first clad layer, a core through which light propagates and alignment marks are simultaneously formed. Further, these layers are covered with a second clad to obtain an optical wiring layer. Then, the optical wiring layer is released from the support substrate and stuck to a substrate having an electric wiring. Subsequently, on the resulting substrate are formed a mirror for reflecting light propagating through the core, pads for installing optical parts or the like, and via holes for electrically connecting the electric wiring on the substrate to the pads. For this formation, the alignment marks are used as references.

Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same

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Tokyo, Japan

Masayuki Ode