Ebara Corporation

Kabushiki Kaisha Toshiba

Ntt Docomo, Inc.

Masayuki Nakanishi

Masaya Seki

Kenya Ito

Kenji Kodera

Tetsuji Togawa

Kenji Yamaguchi

Yu Ishii

Satoru Yamamoto

Yasuyuki Miyasawa

Tamami Takahashi

Kenji Kamimura

Hiroaki Kusa

Makoto Kashiwagi

Hiroyuki Kawasaki

Takeo Kubota

Keisuke Uchiyama

Kenji Iwade

Naoki Matsuda

Atsushi Yoshida

Akihisa Hongo

You Ishii

Kenro Nakamura

Kenichi Kobayashi

Hiroyuki Yano

Atsushi Shigeta

Toshifumi Watanabe

Takeshi Nishioka

Manao Hoshina

Kunio Oishi

Makoto Nakayama

Gen Toyota

Wataru Takita

Michiyoshi Yamashita

Yasuhiko Kokubun

Nobuhiro Yanaka

Masunobu Onozawa

A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

Polishing apparatus

A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

Polishing apparatus and polishing method

One object is to improve the uniformity of polishing of a substrate. The present application discloses, as one embodiment, a substrate polishing device for a quadrilateral-shaped substrate, the device including: a surface plate; a substrate support mechanism that is attached to the surface plate and that supports the substrate; a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism. The substrate support mechanism includes: a base plate; a plate flow passage provided to the base plate; and a plurality of substrate support chambers that are connected to the plate flow passage, wherein each substrate support chamber independently applies a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber.

Substrate polishing device and polishing method

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

Method and apparatus for polishing a substrate, and method for processing a substrate

A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.

Polishing method, polishing apparatus, and substrate processing system

A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction padincluding: a pad main bodyhaving a lower surface adhered to a stageof a substrate holder; and a plurality of circular arc-shaped substrate holding convexities, provided on a top surface of the pad main body, for holding a substrate W attracted by vacuum suction to the top surface of the pad main body, wherein the substrate holding convexitiesare arranged concentrically with the circular pad main body, and width Win a radial direction of the substrate holding convexitylocated on a radially outer side among the plurality of substrate holding convexitiesis narrower than width Win the radial direction of the substrate holding convexityon a radially inner side.

Vacuum suction pad and substrate holder

To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatuscomprises: a holding/polishing unitfor holding and polishing a workpiece W; and an identifying unitfor identifying dataassociated with a state of the peripheral portion of the substrate Wbefore polishing. The holding/polishing unitcomprises: a holderfor holding and rotating the substrate W; and a polisherfor polishing the peripheral portion of the substrate Wby pressing a polishing member against the peripheral portion. A polishing-condition determinerdetermines a polishing condition, based on dataindicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.

A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holderconfigured to hold a substrate W and to rotate the substrate W, and a pressing padconfigured to press a polishing toolagainst a peripheral portion of the substrate W held by the substrate holder. The pressing padincludes an elastic memberhaving a pressing surfaceconfigured to press the polishing toolagainst the peripheral portion of the substrate W and a support memberconfigured to support the elastic member. The support memberhas a recessformed in a front surfaceof the support member, the elastic memberbeing capable of entering the recess

Polishing apparatus and pressing pad for pressing polishing tool

The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

Vacuum contact pad

An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.

Apparatus and method for polishing a surface of a substrate

Pressing member for substrate polishing apparatus

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Growing community of inventors

Tokyo, Japan

Masayuki Nakanishi