Ppg Industries Ohio, Inc.

Ppg Industries, Inc.

Masayuki Nakajima

Tien-Chieh Chao

Richard J Sadvary

Umesh C Desai

Kurt Gordon Olson

Lawrence G Anderson

Thomas R Hockswender

Truman F Wilt

Dennis A Simpson

Hongying Zhou

Marvis E Hartman

Karen A Barkac

Shiryn Tyebjee

Deborah E Hayes

Kymarie L Kuster

Shanti Swarup

Shawn Allen DeSaw

Kaliappa G Ragunathan

Gregory J McCollum

Charles M Kania

Marvin Michael Pollum, Jr

Chia-Cheng Lin

Shan Cheng

Brian K Rearick

Adam Bradley Powell

James P Colton

Constantine A Kondos

Ljiljana Maksimovic

Allison G Condie

David Joseph Fortman

Joseph Peter Kriley

Maria S French

Ronald R Ambrose

Noel Rawle Vanier

Jonathan T Martz

Michael Allen Mayo

Steven R Zawacky

William H Retsch, Jr

Cheng-Hung Hung

Shengkui Hu

Soner Kilic

Michael G Sandala

Charles F Kahle, Ii

Karen S Rechenberg

David B Asay

Kristin M Bartlett

Loubna Pagnotti

Kar Tean Tan

Shawn A De Saw

Laura E Schilling

Anthony Michael Chasser

Suryya K Das

Calum Hugh Munro

Richard M Nugent, Jr

Edward Richard Millero, Jr

Kurt A Humbert

Robert E Jennings

Lorraine Melody Hsu

Edward E McEntire

Robert A Montague

Stephen G McQuown

Peter Lawrence Votruba-Drzal

Britt A Minch

Richard L Coalson

Mary E Grolemund

Shuyu Fang

Jamel S Richardson

Liang Ma

Baptiste Rayer

Kymarje L Koster

Susan A Campbell

Matthew F Hogge

Jr Pollum

Jr Marvin M Pollum

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

Structural adhesive compositions

Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

Compositions containing thermally conductive fillers

The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.

Thiol-containing composition

Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 μm measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.

Coating compositions

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.

Low-temperature curing adhesive compositions

Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 &#x3bc;m measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.

Disclosed herein are methods of preparing an aminimide. An epoxy compound is reacted with a hydrazine compound comprising a trivalent nitrogen, and an anhydride functional material or a cyclic compound containing a carbonyl group and at least one heteroatom alpha to the carbonyl group at a temperature greater than 20&#xb0; C. to form the aminimide. At least one of the epoxy compound and the anhydride functional material or the cyclic compound is polymeric.

Method for producing an aminimide

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

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Wexford, PA, United States of America

Masayuki Nakajima