Fasford Technology Co., Ltd.

Renesas Electronics Corporation

Hitachi High-Tech Instruments Company, Ltd.

Renesas Technology Corp.

Masayuki Mochizuki

Hiroshi Maki

Yoshiaki Makita

Ryuichi Takano

Hideharu Kobashi

Tatsuyuki Okubo

Yukio Tani

Keisuke Nadamoto

Takehito Mochizuki

Haruhiko Fukasawa

Keita Yamamoto

Yoshihide Ishii

Yoshihiro Kurihara

Yasushi Ishii

Takashi Yamagami

Ryo Saegusa

A die bonding apparatus includes a control device for controlling an imaging device. The control device is configured to: detect the dicing grooves by photographing the wafer using the imaging device; roughly determine a central position of the die by calculating the center coordinate of the die on the basis of the detected dicing grooves; move a center of the die to a center of an optical axis of the imaging device on the basis of the center coordinate; photograph the moved die by the imaging device and detect positions of pads possessed by the die on the basis of an image of the photographed die; detect a specific pad arrangement having a unique pitch on the basis of the detected dispositions of the pads; and register the detected specific pad arrangement as a template model.

Die bonding apparatus and manufacturing method for semiconductor apparatus

A die bonding apparatus includes: a driven body; and a table for driving the driven body. The table includes: a base; a linear motor having a first mover that moves the driven body, and a stator; a first linear motion guide that is provided between the base and the stator and capable of freely moving the stator; a second linear motion guide that is provided between the base and the first mover and capable of freely moving the first mover; a second mover provided in the form of being fixed to the base; and a control device for controlling the first mover and the second mover. The control device is configured to move the stator along the first linear motion guide using the second mover.

Die bonding apparatus and manufacturing method for semiconductor device

A bonding method of a die bonder with a single conveyance lane and a single bonding head, or a plurality of conveyance lanes and a plurality of bonding heads includes the steps of generating a classification map of class dies with different electric properties on the wafer, which are classified in accordance with a plurality of grades, picking up the die from the wafer, bonding the die onto a substrate or the die using a bonding head, conveying a class substrate corresponding to the class die on the conveyance lane in a unit of the class substrate, and further bonding the class die to the corresponding class substrate based on the classification map.

Die bonder and bonding method

A two-shaft drive mechanism includes a processing unit, a first linear motor provided with a first movable portion and a first fixed portion, which elevates the processing unit along a first linear guide, and a second linear motor provided with a second movable portion and a second fixed portion, which moves the processing unit in a horizontal direction vertical to the direction for elevating the processing unit, a support body that fixes the first fixed portion, a second linear guide that is provided between the support body and the second fixed portion, and allows the second fixed portion to freely move, and a control unit that controls a position of the first movable portion in the horizontal direction based on an output of the linear sensor that detects a position of the first movable portion in a horizontal direction with respect to the support body.

Two-shaft drive mechanism and die bonder

The present invention aims to provide a lightened reaction absorber or to provide a semiconductor assembling system with further shorter processing time and high productivity or high quality using the lightened reaction absorber. The present invention is based upon a reaction absorber provided with a counter mechanism equipped with a load unit moved in a predetermined direction by a first ball screw, a second ball screw that generates reactive force in a reverse direction to the predetermined direction and a driving unit having a driving motor that drives the first ball screw and the second ball screw, and has a characteristic of including a reaction absorbing unit with one end side equipped with a nut connected to the second ball screw and the other end side fixed to a unit base movable relatively to the counter mechanism.

Reaction absorber and semiconductor assembling system

A die bonder and a bonding method are disclosed which make it possible to provide high-quality products, particularly even if a die is rotated through predetermined degrees relative to an already-bonded die and then laminated. In the die bonder and bonding method in which a die is picked up from a wafer by a pick-up head which then places the die on an alignment stage, and the die is picked up from the alignment stage by a bonding head which then bond the die onto a substrate or an already-bonded die, a posture of the die is rotated through predetermined degrees on a plane parallel to a plane on which the bonding is performed, before the bonding head picks up the die from the alignment stage.

The invention has an object to provide a foreign substance removing device that is capable of quickly and efficiently cleaning substrate surfaces regardless of the size thereof and preventing readhesion of once removed foreign substances as well as to provide a die bonder equipped with the same. The foreign substance removing device of the invention includes: a pickup device to which a dicing film carrying dies thereon is fixed; and a collet for picking up a die separated from the dicing film and placing the die on a substrate having an adhesive applied thereon, and operates to remove foreign substances on the substrate in preparation for application of the adhesive onto the substrate. The foreign substance removing device includes a cleaning nozzle integrating an air outlet orifice and an air inlet orifice.

Foreign substance removing device and die bonder equipped with the same

A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

Fabrication method of semiconductor device

A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.

Growing community of inventors

Kumagaya, Japan

Masayuki Mochizuki