Seiko Epson Corporation

Epson Toyocom Corporation

Masayuki Matsunaga

Yoshihiro Kobayashi

Shojiro Kitamura

Kenji Sato

Akitoshi Hara

Atsushi Ono

A sensor device includes: a sensor component including a package, connection terminals including first connection terminals on a terminal forming surface of the package and a sensor element housed in the package; a resin part covering the sensor component; and mounting leads including a one-end part coupled to one first connection terminal in the resin part so that a main surface thereof faces a main surface of the one first connection terminal face; an intermediate part extending toward a mounting surface of the sensor device from the one-end part; and another-end part externally exposed from the resin part. The sensor component is tilted or orthogonal relative to the mounting surface. The connection terminals are provided along one of the sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface. The intermediate part includes an angled part.

Sensor device

A sensor device includes: a sensor component including a package, connection terminals including first connection terminals on a terminal forming surface of the package and a sensor element housed in the package; and mounting leads including a one-end part coupled to one first connection terminal so that a main surface thereof faces a main surface of the one first connection terminal face; an intermediate part extending toward a mounting surface of the sensor device from the one-end part; and another-end part. The sensor component is tilted or orthogonal relative to the mounting surface. The connection terminals are provided along one of the sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface. The intermediate part includes an angled part.

An inertial sensor, comprises a detection element detecting an amount of a physical quantity in a detection axis direction, a plurality of support members having flexibility and supporting nearly a center of the detection element, and a package substrate housing the detection element and the plurality of support members. In a case when an X-axis is defined as an extending direction of the plurality of support members, a Y-axis is perpendicular to the X-axis in a plane including the detection element, and a Z-axis is perpendicular to the X-axis and the Y-axis, one of load components in a direction of the Y-axis of the detection member applied to the plurality of support members is nearly equal to other among the plurality of support members, and one of load components in a direction of the Z-axis is nearly equal to the other among the plurality of support members.

Inertial sensor, inertial sensor device and manufacturing method of the same

A sensor device includes: a sensor component including a package, connection terminals having first terminals on a terminal forming surface of the package, and a sensor element that has a detection axis and is housed in the package; a resin part covering the sensor component; and mounting leads, each of the mounting leads including, a one-end part formed by being folded so as to be coupled to one of the first connection terminals in the resin part so that a main surface of the one-end part and a main surface of the one of the first connection terminals face each other, an intermediate part extending toward a mounting surface of the sensor device from the one-end part, and an other-end part formed by being folded so as to be externally exposed from the resin part. In the device, the sensor component is tilted or orthogonal with respect to the mounting surface, and the connection terminals are provided along one of sides forming an outline of the terminal forming surface, the one side being tilted or orthogonal with respect to the mounting surface.

An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface.

Electronic device, electronic module, and methods for manufacturing the same

An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element.

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Minowa, Japan

Masayuki Matsunaga