Catalysts & Chemicals Industries Co., Ltd.

Jgc Catalysts & Chemicals Ltd.

Masayuki Matsuda

Toshiharu Hirai

Mitsuaki Kumazawa

Michio Komatsu

Tsuguo Koyanagi

Ryo Muraguchi

Akira Nakashima

Goro Sato

Kazuaki Inoue

Hiroo Yoshidome

Ryota Sueyoshi

Hiroyasu Nishida

Yuji Tawarazako

Atsushi Tonai

Kazutaka Egami

Wataru Futagami

Nobuaki Yoshida

Mitsuru Ohkuma

Yuhko Hakoshima

Satoshi Yoshida

Yuji Tawarasako

Ryo Maruguchi

A water-repellent transparent coating-substrate assembly includes a substrate and a water-repellent transparent coating disposed on a surface of the substrate, the transparent coating including an inorganic oxide fine particle layer containing inorganic oxide fine particles, and an overcoating layer disposed on the inorganic oxide fine particle layer, the surface of the water-repellent transparent coating having irregularities including depressions and protrusions in which the protrusions have an average height (T) in the range of 30 to 500 nm and an average protrusion interval (pitch width) (W) in the range of 50 to 1000 nm, the water-repellent transparent coating having a water contact angle in the range of 130 to 180&#xb0;.

Water-repellant transparent coating-substrate assembly and process for producing the same

A composition for forming a transparent coating film including hollow silica microparticles and a binder is provided. The hollow silica microparticles have an average particle diameter of 5 to 300 nm when measured by the dynamic light scattering method, a specific surface area of 50 to 1500 m/g, and an outer shell in which cavities are formed. The microparticles lose weight by 1.0 W % or more at a temperature in the range of from 200&#xb0; C. to 500&#xb0; C. when measured by the thermogravimetry (TG). A surface charge (QA) of the hollow silica microparticles contained in the compositions for forming a transparent coating film is in the range from 5 to 20 &#x3bc;eq/g.

Composition for forming a transparent coating film including hollow silica particles

A method of producing hollow silica microparticles that suppress whitening of a transparent coating film and show excellent abrasion resistance and adhesiveness. The method includes preparation of an organosol in which hollow silica microparticles are dispersed with the silica concentration of 1 to 70 W % and addition of a silane compound and an alkali catalyst to the organosol at a temperature in the range from 30&#xb0; C. to 300&#xb0; C. to react the silane compound to the hollow silica microparticles under the condition where a quantity of water against the added silica (the hollow silica microparticles) is in the range from 0.1 to 50 W %.

Method of producing hollow silica microparticles

Modified zirconia fine particles which are stable in an acidic region as well as in an alkaline region, and which may be readily adjusted in refractive index in a predetermined range are disclosed. Also disclosed is a substrate with a hard coat film excellent in adhesiveness with the substrate, abrasion resistance, scratch strength, pencil hardness and the like without interference fringes and a coating solution which may form the hard coat film. The substrate with a hard coat film is composed of composite oxide particles formed on at least one surface of the substrate and a matrix component, wherein the composite oxide particles are composite oxide particles having a core-shell structure composed of a core formed from zirconium oxide and a shell formed from antimony pentoxide and/or silica.

Substrate with hard coat film and coating solution for forming hard coat film comprising core-shell composite oxide surface-treated with an organic silicon compound

A transparent film-forming coating liquid is provided which is capable of forming a transparent film that is excellent not only in scratch resistance, film hardness, scratch strength and adhesion to a substrate but also in haze and anti-glare properties. Also provided is a display device having a front panel constituted of a substrate with such a transparent film applied thereto. The transparent film-forming coating liquid comprises inorganic oxide particle groups, in each of which 2 to 10 inorganic oxide particles on an average are linked in the form of a chain, and a polar solvent. In the transparent film-forming coating liquid, the inorganic oxide particles have an average particle diameter of 4 to 200 nm. The inorganic oxide particles are silica particles, and the silica particles are porous particles and/or hollow particles each having a cavity inside.

Transparent film-forming coating liquid, substrate with transparent film, and display device

A chain antimony oxide fine particle group comprising antimony oxide fine particles which have an average particle diameter of 5 to 50 nm, are connected in the form of a chain and have an average connection number of 2 to 30 and preferably used for forming a hard coating film. The fine particle group can be prepared by a process comprising treating an alkali antimonate aqueous solution with a cation exchange resin to prepare an antimonic acid (gel) dispersion and then treating the dispersion with an anion exchange resin and/or adding a base to the dispersion. Also provided is a substrate with a film comprising a substrate and a hard coating film. The hard coating film includes a chain inorganic oxide fine particle group, in which inorganic oxide fine particles of 2 to 30 on the average are connected in the form of a chain, and a matrix. The inorganic oxide particles may be silica particles, silica-alumina particles being preferable, and porous particles and/or hollow particles having a cavity inside being more preferable.

Chain inorganic oxide fine particle groups

There is provided a process for producing an integrated circuit, wherein not only can conductive fine particles be deposited efficiently and densely in minute wiring channels and connecting holes but also a circuit of low wiring resistance and high density can be formed and wherein a high-degree integration can be achieved to thereby bring about an economic advantage. In particular, there is provided a process for producing an integrated circuit, comprising coating a substrate provided with wiring channels with a coating liquid for integrated circuit formation containing conductive fine particles to thereby form an integrated circuit on the substrate, wherein the coating liquid for integrated circuit formation while being exposed to ultrasonic waves is applied to the wiring channels.

Process for producing integrated circuit, and substrate with integrated circuit

Coating liquid for forming a transparent coating and substrate with a transparent coating

Pressure-sensitive pad and production thereof

Transparent conductive coatings excellent in transparency are provided on substrates such as glass, plastics, etc. by the use of conductive coating materials obtained by maintaining aqueous solutions of hydrolyzable tin containing or indium containing compounds at pH of 8-12, and gradually hydrolyzing said compounds in the solutions to form sols containing colloidal particles, followed by drying and calcining.

Process for preparing conductive fine particles and conductive coating

Process for preparing conductive fine particles

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Kitakyushu, Japan

Masayuki Matsuda