Stanley Electric Co., Ltd

Masayuki Makishima

Naochika Horio

Shinichi Tanaka

Masayuki Kanechika

Tomoaki Kodama

Yasuro Kingo

Toshiyuki Sugawara

Mutsumi Morita

A method which has a step of growing a thermostable-state ZnO-based single crystal on a ZnO single crystal substrate at a growth temperature that is equal to or greater than 600&#xb0; C. and less than 900&#xb0; C. by using a metalorganic compound containing no oxygen and water vapor based on an MOCVD method.

Method for growing zinc-oxide-based semiconductor device and method for manufacturing semiconductor light emitting device

A method includes the steps of, using water vapor and a metalorganic compound not containing oxygen, (a) performing crystal growth at a low growth temperature and at a low growth pressure in the range of 1 kPa to 30 kPa to form a low-temperature grown single-crystal layer; and (b) performing crystal growth at a high growth temperature and at a pressure higher than the low growth pressure to form a high-temperature grown single-crystal layer on the low-temperature grown single-crystal layer.

Method of growing zinc-oxide-based semiconductor and method of manufacturing semiconductor light emitting device

A method which has a low-temperature growth step of growing a buffer layer of a ZnO-based single crystal on the substrate at a growth temperature in the range of 250&#xb0; C. to 450&#xb0; C. using a polar oxygen material and a metalorganic compound containing no oxygen; performing a heat treatment of the buffer layer to effect a transition of the buffer layer to a thermostable-state single crystal layer; and a high-temperature growth step of growing the ZnO-based single crystal layer on the thermostable-state single crystal layer at a growth temperature in the range of 600&#xb0; C. to 900&#xb0; C. using a polar oxygen material and a metalorganic compound containing no oxygen.

An apparatus for growing a nitride semiconductor crystal film, comprises a chamber that can control inside temperature and air pressure, a susceptor supported by a rotating shaft inside the chamber and on which a growth substrate is placed, a reactant gas supplier that emits reactant gas to the growth substrate in parallel to a surface of the growth substrate, a first subflow gas supplier that emits first subflow gas for pressing the reactant gas down to the surface of the growth substrate at an inclination angle of 45 to 90 degrees in a same in-plane direction as the reactant gas, a second subflow gas supplier that emits second subflow gas for removing the reactant gas from an periphery of the growth substrate to the surface at an inclination angle of 45 to 90 degrees, and an exhaust device that exhausts gas from the chamber.

Growing community of inventors

Tokyo, Japan

Masayuki Makishima